Investigation of an ambient temperature-curable soy-based adhesive for wood composites

Zheng，Peitao1,2; Zeng，Qinzhi1; Lin，Qiaojia1; Fan，Mizi1,3; Zhou，Jianhui4; Rao，Jiuping1; Chen，Nairong1

2019-12-01

10.1016/j.ijadhadh.2019.102429

INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES   影响因子和分区

0143-7496

1879-0127

Soy-based bio-adhesives are considered as potential substitutes for formaldehyde-based wood adhesives due to their environmental safety and broad availability. However, high curing temperatures (120–180 °C) makes them less energy efficient for wood processing. In the present study, an ambient temperature-curable soy-based adhesive was prepared via the emulsion polymerization of soy flour and styrene. The results of Fourier-transform infrared spectroscopy (FTIR) and proton nuclear magnetic resonance (HNMR) confirmed that N-methylolacrylamide had grafted onto the soy flour components, and subsequently copolymerized with styrene. The developed soy-based adhesive achieved a wet shear strength of 1.04 MPa with 5% styrene and 8% pMDI, which exceeded the bonding strength requirements of plywood for exterior applications. Soy flour components are essential for this ambient temperature-curable adhesive system. The emulsion soy-based adhesive facilitates moisture evaporation at ambient temperature, and polymeric methylenediphenyl diisocyanate (pMDI) was introduced to produce a crosslinked structure with high water resistance and thermal stability. The soy-based adhesive developed in this study showed great potential in wood composites thanks to its high performance and low curing temperature.

Adhesives for wood Composites Macro-shear Water resistance

SCI ; EI

英语

其他

Innovation fund program of Fujian Agriculture and Forestry University[KFA17005A] ; Innovation fund program of Fujian Agriculture and Forestry University[KF2015010] ; Innovation fund program of Fujian Agriculture and Forestry University[KF2015001]

Engineering ; Materials Science

Engineering, Chemical ; Materials Science, Multidisciplinary

WOS:000499734000033

ELSEVIER SCI LTD

20193607391305

Composite materials ; Curing ; Emulsification ; Emulsion polymerization ; Energy efficiency ; Fourier transform infrared spectroscopy ; Nuclear magnetic resonance spectroscopy ; Styrene ; Temperature ; Wood products

Energy Conservation:525.2 ; Thermodynamics:641.1 ; Chemistry:801 ; Chemical Reactions:802.2 ; Chemical Operations:802.3 ; Organic Compounds:804.1 ; Wood and Wood Products:811.2 ; Polymerization:815.2 ; Materials Science:951

MATERIALS SCIENCE

2-s2.0-85071428760

Scopus

1.College of Material EngineeringFujian Agriculture and Forestry University,Fuzhou,35002,China
2.Department of Materials Science & EngineeringSouthern University of Science and Technology,Shenzhen,518055,China
3.Nanocellulose and Biocomposites Research CentreCollege of EngineeringDesign and Physical SciencesBrunel University,UB8 3PH,United Kingdom
4.Integrated Wood EngineeringUniversity of Northern British Columbia,Prince George,V2L 1R6,Canada

Zheng，Peitao,Zeng，Qinzhi,Lin，Qiaojia,et al. Investigation of an ambient temperature-curable soy-based adhesive for wood composites[J]. INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES,2019,95.

Zheng，Peitao.,Zeng，Qinzhi.,Lin，Qiaojia.,Fan，Mizi.,Zhou，Jianhui.,...&Chen，Nairong.(2019).Investigation of an ambient temperature-curable soy-based adhesive for wood composites.INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES,95.

Zheng，Peitao,et al."Investigation of an ambient temperature-curable soy-based adhesive for wood composites".INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES 95(2019).