Microstructures, thermal and mechanical properties of Al–Si-CNT composites for thermal management applications

Ding，Chao1,2; Lu，Zhouguang2; Li，Shukui1; Wang，Ziming3; Yu，Peng2,4; Ye，Shulong1

2023-03-01

10.1016/j.matchemphys.2023.127368

MATERIALS CHEMISTRY AND PHYSICS   影响因子和分区

0254-0584

1879-3312

In this work, a novel electronic packaging material, Al–Si-CNT composite, is fabricated by ball milling and hot extrusion of Al20Si powder blended with different amount of carbon nanotubes (CNTs). The influences of CNTs content on the microstructures, thermal properties and mechanical properties of the composites are investigated. The ball milling produces flake powders in which CNTs, accompanied by refined Si particles and in-situ formed k'-AlO, are uniformly dispersed in the Al matrix. The homogenous microstructures are subsequently inherited by the extruded composites. Compared to the Al20Si sample without CNT addition, the CNT-contained composites are more thermally stable and resistant to structural coarsening caused by Ostwald ripening effect. The composite with 2 wt % CNT content exhibits the best properties among all samples. It has a high tensile yield strength ∼235 MPa, and low thermal expansion coefficient ∼16.8 × 10 K (at 50–400 °C) as well as acceptable thermal conductivity ∼102 WmK (at 50–400 °C). This study using hybrid reinforcements Si and CNTs to enhance the Al matrix composite is inspiring to design high performance thermal management materials.

Extrusion Mechanical properties Metal-matrix composites (MMCs) Microstructural analysis Thermal properties

SCI ; EI

英语

其他

Na-tional Natural Science Foundation of China[52104362] ; Na-tional Key Research and Development Program of China[2021YFB3701900]

Materials Science

Materials Science, Multidisciplinary

WOS:000920424900001

ELSEVIER SCIENCE SA

20230313398017

Alumina ; Aluminum ; Aluminum oxide ; Ball milling ; Electronics packaging ; Extrusion ; Hybrid composites ; Metallic matrix composites ; Milling (machining) ; Powder metals ; Silicon ; Temperature control ; Tensile strength ; Thermal conductivity ; Thermal expansion

Metallurgy and Metallography:531 ; Aluminum:541.1 ; Nonferrous Metals and Alloys excluding Alkali and Alkaline Earth Metals:549.3 ; Machining Operations:604.2 ; Thermodynamics:641.1 ; Specific Variables Control:731.3 ; Nanotechnology:761 ; Chemical Operations:802.3 ; Inorganic Compounds:804.2 ; Crystalline Solids:933.1 ; Materials Science:951

MATERIALS SCIENCE

2-s2.0-85146274733

Scopus

1.Faculty of Materials Science,Shenzhen MSU-BIT University,Shenzhen,518172,China
2.Department of Materials Science and Engineering,Southern University of Science and Technology,Shenzhen,518055,China
3.Department of Materials Science and Engineering,Northwestern University,Evanston,60208,United States
4.Shenzhen ElementPlus Material Technology Co. Ltd.,Shenzhen,518107,China

Ding，Chao,Lu，Zhouguang,Li，Shukui,等. Microstructures, thermal and mechanical properties of Al–Si-CNT composites for thermal management applications[J]. MATERIALS CHEMISTRY AND PHYSICS,2023,297.

Ding，Chao,Lu，Zhouguang,Li，Shukui,Wang，Ziming,Yu，Peng,&Ye，Shulong.(2023).Microstructures, thermal and mechanical properties of Al–Si-CNT composites for thermal management applications.MATERIALS CHEMISTRY AND PHYSICS,297.

Ding，Chao,et al."Microstructures, thermal and mechanical properties of Al–Si-CNT composites for thermal management applications".MATERIALS CHEMISTRY AND PHYSICS 297(2023).