题名 | Electrochemical polishing of tungsten mold |
作者 | |
发表日期 | 2018
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会议录名称 | |
页码 | 395-396
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会议地点 | Venice, Italy
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出版者 | |
摘要 | Owing to its high melting temperature, low coefficient of thermal expansion and acceptable hardness, tungsten alloy has been considered as a very promising mold material for replacement of tungsten carbide for glass lens moulding. For removal of subsurface damage and improvement of surface roughness, polishing is an indispensable step in the manufacturing process of tungsten alloy molds. However, damage-free and highly efficient polishing of tungsten has not been realized yet. In this study, we report the abrasive-free polishing of tungsten alloy using electrochemical polishing (ECP) and apply this process to realize the highly efficient and high quality polishing of tungsten. After 30 min of ECP, the surface Ra roughness has been drastically reduced from 881.4 nm to 35.8 nm and the top surface, slope surface and bottom surface have all been polished. Meanwhile, it has been confirmed that the form accuracy has not been affected demonstrating that ECP is an effective approach for polishing of tungsten molds. |
关键词 | |
学校署名 | 第一
|
语种 | 英语
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相关链接 | [Scopus记录] |
收录类别 | |
EI入藏号 | 20184105929820
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EI主题词 | Electrochemical etching
; Electrolytic polishing
; Molds
; Nanotechnology
; Polishing
; Precision engineering
; Surface roughness
; Thermal expansion
; Tungsten alloys
; Tungsten carbide
|
EI分类号 | Tungsten and Alloys:543.5
; Machining Operations:604.2
; Abrasive Materials:606.1
; Nanotechnology:761
; Inorganic Compounds:804.2
; Physical Properties of Gases, Liquids and Solids:931.2
; Materials Science:951
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Scopus记录号 | 2-s2.0-85054551255
|
来源库 | Scopus
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成果类型 | 会议论文 |
条目标识符 | http://sustech.caswiz.com/handle/2SGJ60CL/44358 |
专题 | 工学院_机械与能源工程系 |
作者单位 | ,Department of Mechanical and Energy Engineering,Southern University of Science and Technology,Shenzhen, Guangdong,No. 1088, Xueyuan Road,518055,China |
第一作者单位 | 机械与能源工程系 |
第一作者的第一单位 | 机械与能源工程系 |
推荐引用方式 GB/T 7714 |
Wang,Fang,Deng,Hui. Electrochemical polishing of tungsten mold[C]:euspen,2018:395-396.
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条目包含的文件 | 条目无相关文件。 |
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