中文版 | English
题名

Electrochemical polishing of tungsten mold

作者
发表日期
2018
会议录名称
页码
395-396
会议地点
Venice, Italy
出版者
摘要
Owing to its high melting temperature, low coefficient of thermal expansion and acceptable hardness, tungsten alloy has been considered as a very promising mold material for replacement of tungsten carbide for glass lens moulding. For removal of subsurface damage and improvement of surface roughness, polishing is an indispensable step in the manufacturing process of tungsten alloy molds. However, damage-free and highly efficient polishing of tungsten has not been realized yet. In this study, we report the abrasive-free polishing of tungsten alloy using electrochemical polishing (ECP) and apply this process to realize the highly efficient and high quality polishing of tungsten. After 30 min of ECP, the surface Ra roughness has been drastically reduced from 881.4 nm to 35.8 nm and the top surface, slope surface and bottom surface have all been polished. Meanwhile, it has been confirmed that the form accuracy has not been affected demonstrating that ECP is an effective approach for polishing of tungsten molds.
关键词
学校署名
第一
语种
英语
相关链接[Scopus记录]
收录类别
EI入藏号
20184105929820
EI主题词
Electrochemical etching ; Electrolytic polishing ; Molds ; Nanotechnology ; Polishing ; Precision engineering ; Surface roughness ; Thermal expansion ; Tungsten alloys ; Tungsten carbide
EI分类号
Tungsten and Alloys:543.5 ; Machining Operations:604.2 ; Abrasive Materials:606.1 ; Nanotechnology:761 ; Inorganic Compounds:804.2 ; Physical Properties of Gases, Liquids and Solids:931.2 ; Materials Science:951
Scopus记录号
2-s2.0-85054551255
来源库
Scopus
成果类型会议论文
条目标识符http://sustech.caswiz.com/handle/2SGJ60CL/44358
专题工学院_机械与能源工程系
作者单位
,Department of Mechanical and Energy Engineering,Southern University of Science and Technology,Shenzhen, Guangdong,No. 1088, Xueyuan Road,518055,China
第一作者单位机械与能源工程系
第一作者的第一单位机械与能源工程系
推荐引用方式
GB/T 7714
Wang,Fang,Deng,Hui. Electrochemical polishing of tungsten mold[C]:euspen,2018:395-396.
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