Recent progress on polyphenylene oxide-based thermoset systems for high-performance copper-clad laminates

Qin, Yijing1,2; Yu, Xueyi2; Fang, Zeming2; He, Xiao3; Qu, Muchao4; Han, Meng5; Lu, Dong1; Xue, Ke2; Wang, Ke2

2023-02-09

10.1088/1361-6463/acb068

JOURNAL OF PHYSICS D-APPLIED PHYSICS   影响因子和分区

0022-3727

1361-6463

With the rapid development of electronic information technology in the 5G era towards high integration, short propagation delay, and elevated assembly temperatures, more academic and industrial attention has been focused on high-frequency and high-speed copper-clad laminates (CCLs). Compared with conventional polymeric matrices, thermoset polyphenylene oxide (PPO) has become one of the most attractive resins applied in high-performance CCLs (HPCCLs) because of its excellent comprehensive properties, including outstanding dielectric properties, high thermal stability, great processibility, and low moisture absorption, etc. This review focuses on the history of the development of PPO prepolymers/oligomers, PPO-based thermoset resin systems, and PPO/inorganic filler composites to optimize the dielectric constant, dielectric loss, thermal conductivity, coefficient of thermal expansion, and mechanical properties. Moreover, some current challenges of PPO-based thermoset systems have been identified, such as developing feasible solutions to ensure the anti-aging properties for long-term reliability under harsh environments of high temperature, high humidity, and even high-frequency electromagnetic radiation. In general, more in-depth investigations of PPO-based thermoset systems for HPCCLs are required in the future.

polyphenylene oxide thermoset systems dielectric loss high performance copper-clad laminate

SCI ; EI

英语

通讯

Department of Science and Technology of Guangdong Province["2020B010179002","2020B010175001"] ; Guangzhou Municipal Science and Technology Bureau, China[202201010869] ; Guangzhou Municipal Science and Technology Bureau[201904010279] ; Science and Technological Bureau of Guangzhou Huangpu District[2019GH03]

Physics

Physics, Applied

WOS:000920371000001

IOP Publishing Ltd

20230613552672

5G mobile communication systems ; Dielectric devices ; Electromagnetic waves ; Resins ; Thermal conductivity ; Thermal expansion ; Thermosets

Thermodynamics:641.1 ; Dielectric Materials:708.1 ; Electromagnetic Waves:711 ; Radio Systems and Equipment:716.3 ; Organic Polymers:815.1.1 ; Materials Science:951

PHYSICS

Web of Science

1.Guangzhou HKUST Fok Ying Tung Res Inst, Ctr Engn Mat & Reliabil, Guangzhou 511458, Peoples R China
2.Southern Univ Sci & Technol, Sch Syst Design & Intelligent Mfg, Shenzhen 518055, Peoples R China
3.China Elect Prod Reliabil & Environm Testing Res I, Reliabil Anal Ctr RAC, Guangzhou 511370, Peoples R China
4.Guangdong Polytech Normal Univ, Sch Automobile & Transportat Engn, Guangzhou 510450, Peoples R China
5.Chinese Acad Sci, Shenzhen Inst Adv Elect Mat, Shenzhen Inst Adv Technol, Shenzhen 518055, Peoples R China

Qin, Yijing,Yu, Xueyi,Fang, Zeming,et al. Recent progress on polyphenylene oxide-based thermoset systems for high-performance copper-clad laminates[J]. JOURNAL OF PHYSICS D-APPLIED PHYSICS,2023,56(6).

Qin, Yijing.,Yu, Xueyi.,Fang, Zeming.,He, Xiao.,Qu, Muchao.,...&Wang, Ke.(2023).Recent progress on polyphenylene oxide-based thermoset systems for high-performance copper-clad laminates.JOURNAL OF PHYSICS D-APPLIED PHYSICS,56(6).

Qin, Yijing,et al."Recent progress on polyphenylene oxide-based thermoset systems for high-performance copper-clad laminates".JOURNAL OF PHYSICS D-APPLIED PHYSICS 56.6(2023).