Guest Editorial: Special Issue on New Trends in Smart Chips and Smart Hardware

Huang, G.-B.1; Eleftheriou, E.S.2; Kudithipudi, D.3; Tapson, J.4; Yu, H.5

2019-02

10.1109/TETCI.2018.2890048

IEEE Transactions on Emerging Topics in Computational Intelligence   影响因子和分区

2471-285X

Special issues and sections Computational intelligence Cloud computing Internet of Things Machine learning Deep learning Smart devices

EI

其他

20190506444394

IEEE

1.School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore; 639798, Singapore
2.IBM Zurich Research Laboratory, Zurich; 8803, Switzerland
3.Computer Engineering Department, NanoComputing Research Laboratory, Kate Gleason College of Engineering, Rochester Institute of Technology, Rochester; NY; 14623, United States
4.MARCS Institute for Brain, Behaviour and Development, School of Computing, Engineering and Mathematics, Western Sydney University, Milperra; NSW; 2751, Australia
5.Southern University of Science and Technology, Shenzhen; 518055, China

Huang, G.-B.,Eleftheriou, E.S.,Kudithipudi, D.,et al. Guest Editorial: Special Issue on New Trends in Smart Chips and Smart Hardware[J]. IEEE Transactions on Emerging Topics in Computational Intelligence,2019,3(1):1-3.

Huang, G.-B.,Eleftheriou, E.S.,Kudithipudi, D.,Tapson, J.,&Yu, H..(2019).Guest Editorial: Special Issue on New Trends in Smart Chips and Smart Hardware.IEEE Transactions on Emerging Topics in Computational Intelligence,3(1),1-3.

Huang, G.-B.,et al."Guest Editorial: Special Issue on New Trends in Smart Chips and Smart Hardware".IEEE Transactions on Emerging Topics in Computational Intelligence 3.1(2019):1-3.