中文版 | English
题名

Improving the drive current of AlGaN/GaN HEMT using external strain engineering

作者
通讯作者Yu, Hongyu
DOI
发表日期
2019
ISBN
978-1-5386-6509-1
会议录名称
页码
374-376
会议日期
12-15 March 2019
会议地点
Singapore, Singapore
出版者
摘要

The concentration of the two-dimensional electron gas (2DEG) at the AlGaN/GaN heterojunction is dominated by the stress developed in AlGaN layer. In this work, the output performance of AlGaN/GaN high electron mobility transistors (HEMTs) was improved by depositing a stressed SiNx as a passivation layer, and the external strain applied onto AlGaN was measured using Raman spectroscopy. As a result, an improvement in on-state resistance and drive current of the device was attained due to the extra 2DEG concentration induced by the external strain. Also, to determine the strain-induced threshold-voltage shift, the stress distribution over the gate region was analyzed.
© 2019 IEEE.

关键词
学校署名
第一 ; 通讯
相关链接[IEEE记录]
收录类别
EI入藏号
20192607103022
EI主题词
Aluminum Alloys ; Aluminum Gallium Nitride ; Electron Gas ; Electrons ; Gallium Alloys ; Gallium Nitride ; Heterojunctions ; Iii-v Semiconductors ; Manufacture ; Passivation ; Semiconductor Alloys ; Strain ; Threshold Voltage ; Two Dimensional Electron Gas
EI分类号
Heat Treatment Processes:537.1 ; Protection Methods:539.2.1 ; Aluminum Alloys:541.2 ; Nonferrous Metals And Alloys Excluding Alkali And Alkaline Earth Metals:549.3 ; Electricity: Basic Concepts And Phenomena:701.1 ; Semiconductor Devices And Integrated Circuits:714.2 ; Inorganic Compounds:804.2 ; Materials Science:951
来源库
EV Compendex
全文链接https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=8731108
引用统计
被引频次[WOS]:0
成果类型会议论文
条目标识符http://sustech.caswiz.com/handle/2SGJ60CL/50906
专题南方科技大学
工学院_深港微电子学院
作者单位
1.Southern University of Science and Technology, Shenzhen, China
2.Washington State University, United States
3.Hong Kong University of Science and Technology, Hong Kong
第一作者单位南方科技大学
通讯作者单位南方科技大学
第一作者的第一单位南方科技大学
推荐引用方式
GB/T 7714
Cheng, Wei-Chih,Lei, Siqi,Li, Wenmao,et al. Improving the drive current of AlGaN/GaN HEMT using external strain engineering[C]:Institute of Electrical and Electronics Engineers Inc.,2019:374-376.
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