中文版 | English
题名

n-Type Polymer Semiconductors Based on Dithienylpyrazinediimide

作者
通讯作者Feng, Kui; Woo, Han Young; Guo, Xugang
共同第一作者Wang, Junwei; Feng, Kui
发表日期
2023
DOI
发表期刊
ISSN
1944-8244
EISSN
1944-8252
卷号15期号:1页码:1639−1651
摘要
The development of n-type organic semiconductors critically relies on the design and synthesis of highly electron-deficient building blocks with good solubility and small steric hindrance. We report here a strongly electron-deficient dithienylpyrazinediimide (TPDI) and its n-type semiconducting polymers. The pyrazine substitution leads to the resulting polymers with much lower-lying lowest unoccupied molecular orbital (LUMO) levels and improved backbone planarity compared to the reported dithienylbenzodiimide (TBDI)- and fluorinated dithienylbenzodiimide (TFBDI)-based polymer analogues, thus yielding n-type transport character with an electron mobility up to 0.44 cm2 V-1 s-1 in organic thin-film transistors. These results demonstrate that dithienylpyrazinediimide is a highly promising electron-deficient building block for constructing high-performance n-type polymers and the incorporation of pyrazine into imide-functionalized (hetero)arenes is an effective strategy to develop n-type polymers with deep-lying frontier molecular orbital (FMO) levels for organic optoelectronic devices.

© 2022 American Chemical Society.

关键词
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收录类别
SCI ; EI
语种
英语
学校署名
第一 ; 共同第一 ; 通讯
资助项目
K.F. acknowledges the financial support by the Shenzhen Basic Research Fund (JCYJ20190809162003662), the Guangdong Basic and Applied Basic Research Foundation (2021A1515011640), and the National Natural Science Foundation of China (22005135). X.G. thanks the National Natural Science Foundation of China (52173171) for financial support. M.A. is grateful to the China Postdoctoral Science Foundation (2022M711464). H.Y.W. acknowledges the financial support from the National Research Foundation of Korea (2019R1A6A1A11044070 and 2020M3H4A3081814). The work at the University of Málaga is supported by the MICINN (project PID2019-110305GB-I00) and by Junta de Andalucía (project P18-FR-4559). This work is also supported by the Center for Computational Science and Engineering at Southern University of Science and Technology. The authors acknowledge the assistance of SUSTech Core Research Facilities.
WOS研究方向
Science & Technology - Other Topics ; Materials Science
WOS类目
Nanoscience & Nanotechnology ; Materials Science, Multidisciplinary
WOS记录号
WOS:000906451300001
出版者
EI入藏号
20230113337291
EI主题词
Electrons ; Molecular Orbitals ; Optoelectronic Devices ; Semiconducting Polymers ; Thin Film Circuits ; Thin Film Transistors
EI分类号
Semiconducting Materials:712.1 ; Semiconductor Devices And Integrated Circuits:714.2 ; Optical Devices And Systems:741.3 ; Physical Chemistry:801.4 ; Atomic And Molecular Physics:931.3
来源库
EV Compendex
引用统计
被引频次[WOS]:6
成果类型期刊论文
条目标识符http://sustech.caswiz.com/handle/2SGJ60CL/519644
专题工学院_材料科学与工程系
前沿与交叉科学研究院
理学院_化学系
作者单位
1.Department of Materials Science and Engineering, Southern University of Science and Technology (SUSTech), Guangdong, Shenzhen; 518055, China
2.Academy for Advanced Interdisciplinary Studies, Southern University of Science and Technology (SUSTech), Guangdong, Shenzhen; 518055, China
3.Department of Chemistry, Southern University of Science and Technology (SUSTech), Guangdong, Shenzhen; 518055, China
4.Department of Chemistry, Korea University, Seoul; 136-713, Korea, Republic of
5.Department of Physical Chemistry, Faculty of Sciences, University of Málaga, Málaga; 29071, Spain
第一作者单位材料科学与工程系
通讯作者单位材料科学与工程系;  前沿与交叉科学研究院
第一作者的第一单位材料科学与工程系
推荐引用方式
GB/T 7714
Ma, Suxiang,Wang, Junwei,Feng, Kui,et al. n-Type Polymer Semiconductors Based on Dithienylpyrazinediimide[J]. ACS Applied Materials & Interfaces,2023,15(1):1639−1651.
APA
Ma, Suxiang.,Wang, Junwei.,Feng, Kui.,Zhang, Hao.,Wu, Ziang.,...&Guo, Xugang.(2023).n-Type Polymer Semiconductors Based on Dithienylpyrazinediimide.ACS Applied Materials & Interfaces,15(1),1639−1651.
MLA
Ma, Suxiang,et al."n-Type Polymer Semiconductors Based on Dithienylpyrazinediimide".ACS Applied Materials & Interfaces 15.1(2023):1639−1651.
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