Dielectric Metalens by Multilayer Nanoimprint Lithography and Solution Phase Epitaxy

Quan, Dunhang1,2; Liu, Xuan1; Tang, Yutao1; Liu, Hongjun1; Min, Siyi1; Li, Guixin1; Srivastava, Abhishek Kumar2; Cheng, Xing1

2023-05-01

10.1002/adem.202201824

ADVANCED ENGINEERING MATERIALS   影响因子和分区

1438-1656

1527-2648

Metasurfaces have ushered in a huge development for their superior ability in manipulating light properties including phase, amplitude, and polarization, which show great potential as alternatives for the refractive optical devices. Recently, many applications of metasurface including metalens have been proposed and investigated, aiming at substituting their refractive counterparts. However, the commonly used fabrication approaches employ electron-beam lithography (EBL) followed by dry etching or atomic layer deposition (ALD) of dielectric materials, which are expensive and inefficient. Besides, dry etching of dielectric materials at sub-100 nm scale with a high aspect ratio is challenging. Herein, a new approach for dielectric metalens fabrication is presented, which combines multilayer nanoimprint lithography and solution phase epitaxy. High aspect ratio ZnO nanopillars with a height-to-diameter ratio of over 7:1 are demonstrated. By using the multilayer nanoimprint lithography, increased aspect ratio nanostructures from shallow imprinting molds are obtained. The highly anisotropic growth characteristic enables nanopillars to grow at a height that exceeds the resist thickness. With this ability, ZnO metalenses are fabricated where the height of nanopillar reaches 1.1 mu m, achieving a focusing efficiency of 50%. The process is cost-effective with a high throughput, which can be widely used for many optical applications.

dielectric metasurface high aspect ratio metalens multilayer nanoimprint lithography solution phase epitaxy zinc oxide

SCI ; EI

英语

第一

Department of Science and Technology of Guangdong Province[2020B0101030001] ; Shenzhen Science and Technology Innovation Committee[JSGG20210420091600002] ; Shenzhen Key Laboratory for Nanoimprint Technology[ZDSYS20140509142721431]

Materials Science

Materials Science, Multidisciplinary

WOS:000986304100001

WILEY-V C H VERLAG GMBH

20232014089980

Aspect ratio ; Atomic layer deposition ; Cost effectiveness ; Dielectric materials ; Dry etching ; Electron beam lithography ; II-VI semiconductors ; Nanoimprint lithography ; Nanostructures ; Zinc oxide

Dielectric Materials:708.1 ; Semiconducting Materials:712.1 ; Reproduction, Copying:745.2 ; Nanotechnology:761 ; Chemical Reactions:802.2 ; Inorganic Compounds:804.2 ; Coating Techniques:813.1 ; Industrial Economics:911.2 ; Solid State Physics:933 ; Crystal Growth:933.1.2

MATERIALS SCIENCE

Web of Science

1.Southern Univ Sci & Technol, Dept Mat Sci & Engn, Shenzhen 518055, Peoples R China
2.Hong Kong Univ Sci & Technol, Dept Elect & Comp Engn, Hong Kong 999077, Peoples R China

Quan, Dunhang,Liu, Xuan,Tang, Yutao,et al. Dielectric Metalens by Multilayer Nanoimprint Lithography and Solution Phase Epitaxy[J]. ADVANCED ENGINEERING MATERIALS,2023,25(16).

Quan, Dunhang.,Liu, Xuan.,Tang, Yutao.,Liu, Hongjun.,Min, Siyi.,...&Cheng, Xing.(2023).Dielectric Metalens by Multilayer Nanoimprint Lithography and Solution Phase Epitaxy.ADVANCED ENGINEERING MATERIALS,25(16).

Quan, Dunhang,et al."Dielectric Metalens by Multilayer Nanoimprint Lithography and Solution Phase Epitaxy".ADVANCED ENGINEERING MATERIALS 25.16(2023).