题名 | Microstructural evolution in ultra-precision grinding of Al/SiCp metal matrix composites |
作者 | |
通讯作者 | Cheung,Chi Fai; Zhang,Bi |
发表日期 | 2023-09-01
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DOI | |
发表期刊 | |
ISSN | 0141-6359
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EISSN | 1873-2372
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卷号 | 83页码:12-21 |
摘要 | Silicon carbide (SiC) particle reinforced aluminum (Al) metal matrix composites (Al/SiCp MMCs) have been utilized in many engineering applications because of their superior properties. However, poor surface integrity is normally induced in conventional machining of Al/SiCp MMCs due to the heterogeneous constituents, which substantially undermines its performance and service life. This is because although a high surface quality with excellent surface finish is achieved, subsurface damage (SSD) of machined workpieces is usually neglected in conventional machining of Al/SiCp MMCs. To preserve the surface integrity of Al/SiCp MMCs, this study performs ultra-precison grinding (UPG) to explore speed effect on the microstructural evolution and material removal mechanisms of Al/SiCp MMCs. Surface morphology observation reveals that grinding scratches, grinding chips, surface pits and side flow are the major characteristics due to broken SiC particles and drastic plastic deformation caused by the grinding processes. Although an increased grinding speed does not induce significant difference to the morphology of ground surfaces, it leads to distinct microstructural alterations and substantially reduced depth of subsurface damage. SSD characterization reveals that the ground subsurface is characterized by a topmost hybrid layer and an underlying plastic deformation layer. Continuous dynamic recrystallization is determined as the mechanism of Al grain refinement based on the features of dislocation arrays in the refined Al grains. Strain-rate effect plays a dominant role during Al alloy matrix deformation in UPG because of the reduced plastic deformation in comparison to the workpieces subjected to conventional grinding. The reduced SSD depth in UPG of Al/SiCp indicates a high surface integrity, revealing a result of damage skin effect. This study indicates that the damage skin effect is widely applicable in grinding of Al/SiCp MMCs at an increased grinding speed through mitigating the plastic deformation of the ductile matrix. |
关键词 | |
相关链接 | [Scopus记录] |
收录类别 | |
语种 | 英语
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学校署名 | 通讯
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资助项目 | Innovation and Technology Commission[GHP/142/19SZ];Science, Technology and Innovation Commission of Shenzhen Municipality[JCYJ20210324115413036];Science, Technology and Innovation Commission of Shenzhen Municipality[KQTD20190929172505711];
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WOS研究方向 | Engineering
; Science & Technology - Other Topics
; Instruments & Instrumentation
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WOS类目 | Engineering, Multidisciplinary
; Engineering, Manufacturing
; Nanoscience & Nanotechnology
; Instruments & Instrumentation
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WOS记录号 | WOS:001053529100001
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出版者 | |
EI入藏号 | 20232014106041
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EI主题词 | Aluminum alloys
; Dynamic recrystallization
; Grain refinement
; Metallic matrix composites
; Microstructural evolution
; Morphology
; Particle reinforced composites
; Plastic deformation
; Silicon carbide
; Strain rate
; Surface morphology
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EI分类号 | Metallurgy and Metallography:531
; Metallurgy:531.1
; Aluminum Alloys:541.2
; Machining Operations:604.2
; Inorganic Compounds:804.2
; Physical Properties of Gases, Liquids and Solids:931.2
; Materials Science:951
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ESI学科分类 | ENGINEERING
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Scopus记录号 | 2-s2.0-85159377022
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来源库 | Scopus
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引用统计 |
被引频次[WOS]:7
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成果类型 | 期刊论文 |
条目标识符 | http://sustech.caswiz.com/handle/2SGJ60CL/536403 |
专题 | 工学院_机械与能源工程系 |
作者单位 | 1.State Key Laboratory of Ultra-precision Machining Technology,Department of Industrial and Systems Engineering,The Hong Kong Polytechnic University,Kowloon,Hung Hom, Hong Kong,China 2.Department of Mechanical and Energy Engineering,Southern University of Science and Technology,Shenzhen,518055,China |
第一作者单位 | 机械与能源工程系 |
通讯作者单位 | 机械与能源工程系 |
推荐引用方式 GB/T 7714 |
Guo,Sai,Cheung,Chi Fai,Ho,Lai Ting,et al. Microstructural evolution in ultra-precision grinding of Al/SiCp metal matrix composites[J]. Precision Engineering,2023,83:12-21.
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APA |
Guo,Sai,Cheung,Chi Fai,Ho,Lai Ting,&Zhang,Bi.(2023).Microstructural evolution in ultra-precision grinding of Al/SiCp metal matrix composites.Precision Engineering,83,12-21.
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MLA |
Guo,Sai,et al."Microstructural evolution in ultra-precision grinding of Al/SiCp metal matrix composites".Precision Engineering 83(2023):12-21.
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