各向同性电化学刻蚀轮廓包络抛光方法研究

金属由于具有优异的综合性能被广泛应用于航空航天、生物医疗、化工以及消费品领域。随着现代科技的发展，金属材料的应用领域得到了进一步的发展，同时对于金属零件的表面质量要求也越来越高。针对这一需求，金属材料的表面抛光技术得到了大量的研究，其中电化学抛光作为一种无应力抛光技术，可以提供光滑、耐腐蚀的表面，被广泛应用于金属材料的表面抛光。

电化学抛光技术(Electrochemical polishing，ECP)发展至今已有近百年历史，在医疗植入物、半导体装置、3D打印件等高科技领域有重要的应用。然而关于电化学抛光的理论研究目前仍然没有统一的认识，特别是一些新的工艺和技术的出现，比如离子液体抛光、脉冲电流抛光和磁电抛光，使得建立统一的电化学抛光理论更加困难。本论文以纯钛作为主要研究对象，对其电化学溶解过程中的各向同性刻蚀模式和各向异性刻蚀模式进行了深入的研究，揭示了金属表面电化学刻蚀模式调控的机理，并以此为基础提出了一种具有普适性的电化学各向同性刻蚀轮廓包络抛光技术(Isotropic etching polishing，IEP)，实现了不同金属材料的表面抛光。

论文的主要研究内容如下：

(1) 研究了纯钛表面电化学刻蚀的基本过程，提出了一种基于金属表面各向同性刻蚀轮廓包络原理的IEP技术，建立了IEP的表面形貌预测模型。通过对纯钛表面各向同性刻蚀孔的形成机理及工艺进行系统研究，实现了纯钛和TC4双相钛合金的纳米级表面抛光效果。

(2) 揭示了金属表面各向同性刻蚀与各向异性刻蚀两种模式的产生机理。研究了不同实验参数对纯钛表面刻蚀模式的影响，并掌握了金属材料刻蚀模式调控的基本原理与工艺方法。实现了对于其他常见金属材料如304不锈钢，纯镍和6063铝合金刻蚀模式的精确调控以及表面抛光。

(3) 从刻蚀行为演变规律的角度对比研究了钨在不同电解液体系中的各向同性刻蚀轮廓包络抛光与粘液层电化学抛光。测量了钨在不同电解液体系中的极化曲线。对比了钨在各向同性和各向异性模式下刻蚀后的表面形貌。钨在两种电解液体系中的抛光过程均存在各向异性到各向同性的刻蚀模式转变，证明了各向同性刻蚀在传统粘液层抛光理论中也具有关键作用。

(4) 研究了多晶金属材料(如：纯钛、纯钨和不锈钢)和非晶NiP合金在各向同性刻蚀抛光时的极限表面粗糙度。从NiP非晶合金的电化学溶解特性出发，研究了NiP非晶合金IEP的基本原理，掌握了NiP非晶合金的亚纳米级表面加工工艺。在此基础上，验证了IEP对NiP合金表面微结构阵列的影响。

本论文对金属材料电化学溶解基本过程进行了深入的理论分析与实验研究，提出了一种具有普适性的电化学各向同性刻蚀轮廓包络抛光方法，实现了多种金属材料亚纳米级表面抛光效果。本论文的研究完善了金属材料电化学抛光理论，为金属材料的高效超精密抛光加工提供了切实可行的理论基础与技术支持。

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