基于粘接力调节有机硅热界面材料/铝界面热导研究

为了强化电子器件内固体之间的传热能力，通常在界面之间填充导热 性能优异的热界面材料，而良好的粘接性能不仅能保证热界面材料导热性 能稳定发挥，也能保证界面处填缝的可靠性。本文基于分子设计，从聚合 物/填料体系的交联密度、填料种类及含量等本征结构参数入手，通过强化 粘接力来优化界面热导。结合基板表面粗糙度、热界面材料的表面能和热 导率，通过对界面热导预测模型进行适当简化并建立界面热导关于粘接力 的数学模型，对模型中的参数进行测试，得到了与理论计算值较为吻合的 不同粘接样品下的有机硅热界面材料/铝之间的界面热导的测量结果。 在铝粉有机硅热界面材料体系中，通过调节基体的交联密度、铝粉的 含量、硅烷偶联剂的含量来调节有机硅热界面材料与铝之间的粘接性能， 采用时域热反射法测量不同粘接力下的有机硅热界面材料与铝之间的界面 热导，结合粗糙度、表面能、热导率等参数及简化后的模型对界面热导进 行拟合并将拟合结果与实验结果对比，成功验证模型的准确性。 本文借助有机硅柔顺性和环氧官能团对粘接的促进作用，强化界面热 导的同时进一步将模型推广至氮化硼有机硅热界面材料体系中。并借助该 模型调整环氧大豆油及氨基硅油摩尔比、氮化硼含量、表面能、粗糙度等 参数调节有机硅热界面材料与铝之间的粘接性能来增强界面传热。

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