Improvement in the Thermal Conductivity of Silver Epoxy Adhesive by Treating with Water Vapor

Yiyang, E.1; Tian, Zhaobo1,2,3; Chi, Keyu4; Jiang, Renyao1; Lv, You1; Sun, Qi4; Zhu, Yuan1

2023-05-17

10.3390/polym15102338

POLYMERS   影响因子和分区

2073-4360

With the miniaturization of electronic devices, electronic packaging has become increasingly precise and complex, which presents a significant challenge in terms of heat dissipation. Electrically conductive adhesives (ECAs), particularly silver epoxy adhesives, have emerged as a new type of electronic packaging material, thanks to their high conductivity and stable contact resistance. However, while there has been extensive research on silver epoxy adhesives, little attention has been paid to improving their thermal conductivity, which is a critical requirement in the ECA industry. In this paper, we propose a straightforward method for treating silver epoxy adhesive with water vapor, resulting in a remarkable improvement in thermal conductivity to 9.1 W/(m center dot K), three times higher than the sample cured using traditional methods (2.7 W/(m center dot K)). Through research and analysis, the study demonstrates that the introduction of H2O into the gaps and holes of the silver epoxy adhesive increases the path of electron conduction, thereby improving thermal conductivity. Furthermore, this method has the potential to significantly improve the performance of packaging materials and meet the needs of high-performance ECAs.

vapor silver epoxy adhesive thermal conductivity electrical conductivity silver particles

SCI ; EI

英语

第一 ; 通讯

National Science Fund for Excellent Young Scholars[52122607] ; National Natural Science Foundation of China["U20A20241","52272114","52202232","51872153"] ; Technology Innovation Commission of Shenzhen[JCYJ20210324104608024] ; State Key Laboratory of New Ceramic and Fine Processing Tsinghua University[KF202206]

Polymer Science

Polymer Science

WOS:000997437500001

MDPI

20232314177515

Adhesives ; Electronics packaging ; Packaging materials ; Thermal conductivity ; Water treatment ; Water vapor

Water Treatment Techniques:445.1 ; Precious Metals:547.1 ; Thermodynamics:641.1 ; Packaging Materials:694.2

Web of Science

1.Southern Univ Sci & Technol, Sch Microelect, Shenzhen 518055, Peoples R China
2.Baopeng New Mat Technol Co Ltd, Shenzhen 518055, Peoples R China
3.Southern Inst Ind Technol, Shenzhen 518055, Peoples R China
4.Foshan Southern China Inst New Mat, Foshan 528000, Peoples R China

Yiyang, E.,Tian, Zhaobo,Chi, Keyu,et al. Improvement in the Thermal Conductivity of Silver Epoxy Adhesive by Treating with Water Vapor[J]. POLYMERS,2023,15(10).

Yiyang, E..,Tian, Zhaobo.,Chi, Keyu.,Jiang, Renyao.,Lv, You.,...&Zhu, Yuan.(2023).Improvement in the Thermal Conductivity of Silver Epoxy Adhesive by Treating with Water Vapor.POLYMERS,15(10).

Yiyang, E.,et al."Improvement in the Thermal Conductivity of Silver Epoxy Adhesive by Treating with Water Vapor".POLYMERS 15.10(2023).