超高速单颗粒磨削单晶硅的裂纹演化与材料去除机理研究

       出于对环境保护的目的，全球对各国的碳排放提出了要求， 继而对生
产能耗做出了相应限制。 能耗的限制必然要求工业生产以更加绿色高效的
方式进行。超高速磨削以其绿色高效的特点未来有潜力成为主要的工业生
产技术之一。 然而，目前学界对超高速加工中的损伤和材料去除机理仍然
没有完全清晰。 本文研究了单晶硅在超高速加工中的裂纹产生与抑制机理，
探讨了单晶硅的切屑形态演化。
      当加工速度在 150 m/s 以下，且加工深度大于表面“ 延性域” 临界深度
时，单晶硅的亚表面与表面产生裂纹。 裂纹可起源于单滑移带和双滑移带
交汇处。 单滑移带在扩展过程中，其尖端附近的应力场呈现局部拉伸的特
征。局部的拉伸应力导致滑移带尖端产生 I 型裂纹主导的断裂。 单滑移带所
产生的裂纹与滑移带呈现~70.5°夹角。 双滑移带交汇产生裂纹的原因是滑
移带内部的剪应力在交汇处形成应力迭加， 迭加后的应力状态在特定方向
上呈现拉伸状态。 在以上两种情况下，如果局部拉伸应力所构成的应力场
强因子超出材料的临界应力场强因子， 将导致裂纹产生。 当加工速度高于
150 m/s 时，加工速度导致的高压场与可能形成裂纹的局部拉伸应力迭加，
使得局部应力呈现压缩状态，从而抑制裂纹的产生。
      当加工深度小于表面“ 延性域”临界深度时， 单晶硅可被看作塑性材
料。 分子动力学模拟结果表明， 随着加工速度的提高， 绝热剪切带逐渐消
失， 压力会主导刀具前方材料的去除模式， 刀具前方的切屑形态从断屑转
变成喷射形态，这意味着在超高速加工下材料不失稳。 本文从冲击理论的
角度解释了压力主导材料失效的现象以及冲击波速与加工速度的关系。 该
项研究有助于提高对超高速加工中材料去除机理的理解，为后续超高速加
工的应用打下理论基础。
 

[1] Klocke F, Brinksmeier E, Evans C, et al. High-Speed Grinding-Fundamentals and State of the Art in Europe, Japan, and the USA[J]. CIRP Annals, 1997, 46(2): 715-724.
[2] Zener C, Hollomon J H. Effect of Strain Rate Upon Plastic Flow of Steel[J]. J. Appl. Phys, 1944, 15(1): 22-32.
[3] Zhang B, Yin J. The ‘skin effect’ of subsurface damage distribution in materials subjected to high-speed machining[J]. International Journal of Extreme Manufacturing, 2019, 1(1): 012007.
[4] Meyers M A. Dynamic behavior of materials[M]. John Wiley & Sons, 1994.
[5] 王礼立, 胡时胜, 杨黎明, 等. 材料动力学[M]. 合肥: 中国科学技术大学出版社, 2017.
[6] Salomon C J. Process for machining metals of similar acting materials when being worked by cutting tools: 523594[P]. 1931.
[7] Longbottom J M, Lanham J D. A review of research related to Salomon’s hypothesis on cutting speeds and temperatures[J]. International Journal of Machine Tools and Manufacture, 2006, 46(14): 1740-1747.
[8] Bifano T G, Dow T A, Scattergood R O. Ductile-Regime Grinding: A New Technology for Machining Brittle Materials[J]. Journal of Engineering for Industry, 1991, 113(2): 184-189.
[9] Zhang B, Tokura H, Yoshikawa M. Study on surface cracking of alumina scratched by single-point diamonds[J]. Journal of Materials Science, 1988, 23(9): 3214-3224.
[10] Samuels J, Roberts S G, Hirsch P B. The brittle–ductile transition in silicon. I. Experiments[J]. Proceedings of the Royal Society of London. A. Mathematical and Physical Sciences, 1989, 421(1860): 1-23.
[11] Hirsch P B, Roberts S G, Samuels J. The brittle-ductile transition in silicon. II. Interpretation[J]. Proceedings of the Royal Society of London. A. Mathematical and Physical Sciences, 1989, 421(1860): 25-53.
[12] 张诗曼, 黄树涛, 许立福, 等. 高速铣削高强度钢切屑形态及影响因素研究[J]. 工具技术, 2021, 55(12): 19-24.
[13] 王敏杰, 王阳, 魏兆成, 等. 切削过程绝热剪切带的滑移线场研究[J]. 机械工程学报, 2022, 58(7): 11.
[14] 李志刚, 李淑欣, 余丰, 等. 试样形状对轴承钢绝热剪切带微观组织的影响[J]. 爆炸与冲击, 2023, 43(4): 53-63.
[15] Wright T W. The physics and mathematics of adiabatic shear bands[M]. Cambridge University Press, 2002.
[16] Davies M A, Burns T J, Evans C J. On the Dynamics of Chip Formation in Machining Hard Metals[J]. CIRP Annals, 1997, 46(1): 25-30.
[17] Ma W, Chen X, Shuang F. The chip-flow behaviors and formation mechanisms in the orthogonal cutting process of Ti6Al4V alloy[J]. Journal of the Mechanics and Physics of Solids, 2017, 98: 245-270.
[18] Cai S L, Dai L H. Suppression of repeated adiabatic shear banding by dynamic large strain extrusion machining[J]. Journal of the Mechanics and Physics of Solids, 2014, 73: 84-102.
[19] Ye G G, Xue S F, Ma W, et al. Cutting AISI 1045 steel at very high speeds[J]. International Journal of Machine Tools and Manufacture, 2012, 56: 1-9.
[20] Sutter G, List G. Very high speed cutting of Ti–6Al–4V titanium alloy–change in morphology and mechanism of chip formation[J]. International Journal of Machine Tools and Manufacture, 2013, 66: 37-43.
[21] Zhang J, He B, Zhang B. Failure mode change and material damage with varied machining speeds: a review[J]. International Journal of Extreme Manufacturing, 2023, 5(2): 022003.
[22] Bai Y L. Thermo-plastic instability in simple shear[J]. Journal of the Mechanics and Physics of Solids, 1982, 30(4): 195-207.
[23] Johnson G R, Cook W H. Fracture characteristics of three metals subjected to various strains, strain rates, temperatures and pressures[J]. Engineering fracture mechanics, 1985, 21(1): 31-48.
[24] Klopp R W, Clifton R J, Shawki T G. Pressure-shear impact and the dynamic viscoplastic response of metals[J]. Mechanics of Materials, 1985, 4(3): 375-385.
[25] Messerschmidt U. Dislocation dynamics during plastic deformation: Vol. 129[M]. Springer Science & Business Media, 2010.
[26] Hull D, Bacon D J. Introduction to dislocations[M]. Butterworth-Heinemann, 2001.
[27] Regazzoni G, Kocks U F, Follansbee P S. Dislocation kinetics at high strain rates[J]. Acta Metallurgica, 1987, 35(12): 2865-2875.
[28] Follansbee P S, Kocks U F. A constitutive description of the deformation of copper based on the use of the mechanical threshold stress as an internal state variable[J]. Acta Metallurgica, 1988, 36(1): 81-93.
[29] Wedberg D, Lindgren L E. Modelling flow stress of AISI 316L at high strain rates[J]. Mechanics of Materials, 2015, 91: 194-207.
[30] Hoge K G, Mukherjee A K. The temperature and strain rate dependence of the flow stress of tantalum[J]. Journal of Materials Science, 1977, 12(8): 1666-1672.
[31] Zerilli F J, Armstrong R W. The effect of dislocation drag on the stress-strain behavior of F.C.C. metals[J]. Acta Metallurgica, 1992, 40(8): 1803-1808.
[32] Gao C Y, Zhang L C. Constitutive modelling of plasticity of fcc metals under extremely high strain rates[J]. International Journal of Plasticity, 2012, 32-33: 121-133.
[33] Rice J R, Tracey D M. On the ductile enlargement of voids in triaxial stress fields[J]. Journal of the Mechanics and Physics of Solids, 1969, 17(3): 201-217.
[34] Huang Y. Accurate dilatation rates for spherical voids in triaxial stress fields[J]. Journal of Applied Mechanics, Transactions ASME, 1991, 58: 1084-1086.
[35] Seppälä E T, Belak J, Rudd R E. Effect of stress triaxiality on void growth in dynamic fracture of metals: A molecular dynamics study[J]. Physical Review B, 2004, 69(13): 134101.
[36] Seppälä E T, Belak J, Rudd R E. Three-dimensional molecular dynamics simulations of void coalescence during dynamic fracture of ductile metals[J]. Physical Review B, 2005, 71(6): 064112.
[37] Marian J, Knap J, Ortiz M. Nanovoid cavitation by dislocation emission in aluminum[J]. Physical Review Letters, 2004, 93(16): 165503.
[38] Marian J, Knap J, Ortiz M. Nanovoid deformation in aluminum under simple shear[J]. Acta Materialia, 2005, 53(10): 2893-2900.
[39] Gurson A L. Continuum Theory of Ductile Rupture by Void Nucleation and Growth: Part I—Yield Criteria and Flow Rules for Porous Ductile Media[J]. Journal of Engineering Materials and Technology, 1977, 99(1): 2-15.
[40] Johnson J N. Dynamic fracture and spallation in ductile solids[J]. Journal of Applied Physics, 1981, 52(4): 2812-2825.
[41] Seaman L, Curran D R, Shockey D A. Computational models for ductile and brittle fracture[J]. Journal of Applied Physics, 1976, 47(11): 4814-4826.
[42] Tvergaard V, Needleman A. Analysis of the cup-cone fracture in a round tensile bar[J]. Acta Metallurgica, 1984, 32(1): 157-169.
[43] Rogers H C. Adiabatic plastic deformation[J]. Annual Review of Materials Science, 1979, 9(1): 283-311.
[44] Oxley P L B, Shaw M C. Mechanics of machining: an analytical approach to assessing machinability[J]. 1990.
[45] Antoun T, Curran D R, Seaman L, et al. Spall fracture[M]. Springer Science & Business Media, 2003.
[46] Rankine W J M. On the thermodynamic theory of waves of finite longitudinal disturbance[J]. Philosophical Transactions of the Royal Society of London, 1870(160): 277-288.
[47] Salas M D. The curious events leading to the theory of shock waves[J]. Shock Waves, 2007, 16(6): 477-487.
[48] Anderson T L. Fracture mechanics: fundamentals and applications[M]. CRC press, 2017.
[49] Griffith A A, Taylor G I. VI. The phenomena of rupture and flow in solids[J]. Philosophical Transactions of the Royal Society of London. Series A, Containing Papers of a Mathematical or Physical Character, 1997, 221(582-593): 163-198.
[50] CE I. Stresses in a plate due to the presence of cracks and sharp corners[J]. Trans Inst Naval Archit, 1913, 55: 219-241.
[51] Westergaard H M. Bearing pressures and cracks: Bearing pressures through a slightly waved surface or through a nearly flat part of a cylinder, and related problems of cracks[J]. 1939.
[52] Thouless M D, Evans A G, Ashby M F, et al. The edge cracking and spalling of brittle plates[J]. Acta Metallurgica, 1987, 35(6): 1333-1341.
[53] Kendall K, Cottrell A H. Complexities of compression failure[J]. Proceedings of the Royal Society of London. A. Mathematical and Physical Sciences, 1997, 361(1705): 245-263.
[54] Ashby M F, Hallam (Née Cooksley) S D. The failure of brittle solids containing small cracks under compressive stress states[J]. Acta Metallurgica, 1986, 34(3): 497-510.
[55] Lawn B R, Marshall D B. Hardness, Toughness, and Brittleness: An Indentation Analysis[J]. Journal of the American Ceramic Society, 1979, 62(7-8): 347-350.
[56] Lawn B, Wilshaw R. Indentation fracture: principles and applications[J]. Journal of Materials Science, 1975, 10(6): 1049-1081.
[57] Lawn B R, Swain M V. Microfracture beneath point indentations in brittle solids[J]. Journal of Materials Science, 1975, 10(1): 113-122.
[58] Huang H, Lawn B R, Cook R F, et al. Critique of materials-based models of ductile machining in brittle solids[J]. Journal of the American Ceramic Society, 2020, 103(11): 6096-6100.
[59] Zarudi I, Zhang L C, Cheong W C D, et al. The difference of phase distributions in silicon after indentation with Berkovich and spherical indenters[J]. Acta Materialia, 2005, 53(18): 4795-4800.
[60] Zarudi I, Zhang L C. Effect of ultraprecision grinding on the microstructural change in silicon monocrystals[J]. Journal of Materials Processing Technology, 1998, 84(1): 149-158.
[61] Feng J, Huang X, Yang S, et al. Speed effect on the material behavior in high-speed scratching of BK7 glass[J]. Ceramics International, 2021, 47(14): 19978-19988.
[62] Schinker M G. Subsurface damage mechanisms at high-speed ductile machining of optical glasses[J]. Precision Engineering, 1991, 13(3): 208-218.
[63] Yang M, Li C, Zhang Y, et al. Maximum undeformed equivalent chip thickness for ductile-brittle transition of zirconia ceramics under different lubrication conditions[J]. International Journal of Machine Tools and Manufacture, 2017, 122: 55-65.
[64] Lee Y J, Senthil Kumar A, Wang H. Beneficial stress of a coating on ductile-mode cutting of single-crystal brittle material[J]. International Journal of Machine Tools and Manufacture, 2021, 168: 103787.
[65] Gu X, Wang H, Zhao Q, et al. Effect of cutting tool geometries on the ductile-brittle transition of monocrystalline sapphire[J]. International Journal of Mechanical Sciences, 2018, 148: 565-577.
[66] Yan J, Asami T, Harada H, et al. Crystallographic effect on subsurface damage formation in silicon microcutting[J]. CIRP Annals, 2012, 61(1): 131-134.
[67] Axinte D, Butler-Smith P, Akgun C, et al. On the influence of single grit micro-geometry on grinding behavior of ductile and brittle materials[J]. International Journal of Machine Tools and Manufacture, 2013, 74: 12-18.
[68] Mitrofanov A V, Babitsky V I, Silberschmidt V V. Finite element analysis of ultrasonically assisted turning of Inconel 718[J]. Journal of Materials Processing Technology, 2004, 153-154: 233-239.
[69] Umbrello D, M’Saoubi R, Outeiro J C. The influence of Johnson–Cook material constants on finite element simulation of machining of AISI 316L steel[J]. International Journal of Machine Tools and Manufacture, 2007, 47(3): 462-470.
[70] Shrot A, Bäker M. Determination of Johnson–Cook parameters from machining simulations[J]. Computational Materials Science, 2012, 52(1): 298-304.
[71] Molinari A, Soldani X, Miguélez M H. Adiabatic shear banding and scaling laws in chip formation with application to cutting of Ti–6Al–4V[J]. Journal of the Mechanics and Physics of Solids, 2013, 61(11): 2331-2359.
[72] 董朝阳. 热塑性复合材料干摩擦滑动界面粘着与转移行为机理实验研究[D]. 重庆大学, 2021.
[73] Stillinger F H, Weber T A. Computer simulation of local order in condensed phases of silicon[J]. Physical Review B, 1985, 31(8): 5262-5271.
[74] Tersoff J. Chemical order in amorphous silicon carbide[J]. Physical Review B, 1994, 49(23): 16349.
[75] 苟勇军. 基于分子动力学的单晶钨切削亚表面损伤研究[D]. 大连理工大学, 2023.
[76] Abdulkadir L N, Abou-El-Hossein K, Jumare A I, et al. Review of molecular dynamics/experimental study of diamond-silicon behavior in nanoscale machining[J]. The International Journal of Advanced Manufacturing Technology, 2018, 98(1): 317-371.
[77] Hahn E N, Germann T C, Ravelo R, et al. On the ultimate tensile strength of tantalum[J]. Acta Materialia, 2017, 126: 313-328.
[78] 卢守相, 杨秀轩, 张建秋, 等. 关于硬脆材料去除机理与加工损伤的理性思考[J]. 机械工程学报, 2022, 58(15): 31-45.
[79] Yan Y D, Dong S, Sun T. 3D force components measurement in AFM scratching tests[J]. Ultramicroscopy, 2005, 105(1): 62-71.
[80] Yan Y D, Sun T, Liang Y C, et al. Effects of scratching directions on AFM-based abrasive abrasion process[J]. Tribology International, 2009, 42(1): 66-70.
[81] Briscoe B J, Delfino A, Pelillo E. Single-pass pendulum scratching of poly (styrene) and poly (methylmethacrylate)[J]. Wear, 1999, 225: 319-328.
[82] Zhang Z, Guo D, Wang B, et al. A novel approach of high speed scratching on silicon wafers at nanoscale depths of cut[J]. Scientific Reports, 2015, 5(1): 1-9.
[83] 刘瑞娟, 聂卓赟, 邵辉, 等. 基于扩张状态观测器的迟滞非线性系统辨识[J]. 仪器仪表学报, 2017, 38(8): 8.
[84] 曹腾, 李晓牛, 王柏权, 等. 单相压电电机驱动的高精度孔径光阑设计[J]. 中国机械工程, 2022, 33(20): 6.
[85] Liu Q, Liao Z, Axinte D. Temperature effect on the material removal mechanism of soft-brittle crystals at nano/micron scale[J]. International Journal of Machine Tools and Manufacture, 2020, 159: 103620.
[86] Huang H, Li X, Mu D, et al. Science and art of ductile grinding of brittle solids[J]. International Journal of Machine Tools and Manufacture, 2021, 161: 103675.
[87] Zhang S, Zong W. Micro defects on diamond tool cutting edge affecting the ductile-mode machining of KDP crystal[J]. Micromachines, 2020, 11(12): 1102.
[88] O’Connor B P, Marsh E R, Couey J A. On the effect of crystallographic orientation on ductile material removal in silicon[J]. Precision Engineering, 2005, 29(1): 124-132.
[89] Huang W, Yan J. Chip-free surface patterning of toxic brittle polycrystalline materials through micro/nanoscale burnishing[J]. International Journal of Machine Tools and Manufacture, 2021, 162: 103688.
[90] Mohammadi H, Ravindra D, Kode S K, et al. Experimental work on micro laser-assisted diamond turning of silicon (111)[J]. Journal of Manufacturing Processes, 2015, 19: 125-128.
[91] Liu C, Chen X, Ke J, et al. Numerical investigation on subsurface damage in nanometric cutting of single-crystal silicon at elevated temperatures[J]. Journal of Manufacturing Processes, 2021, 68: 1060-1071.
[92] Chen X, Liu C, Ke J, et al. Subsurface damage and phase transformation in laser-assisted nanometric cutting of single crystal silicon[J]. Materials & Design, 2020, 190: 108524.
[93] Li C, Li X, Wu Y, et al. Deformation mechanism and force modelling of the grinding of YAG single crystals[J]. International Journal of Machine Tools and Manufacture, 2019, 143: 23-37.
[94] Huang H, Yin L, Zhou L. High speed grinding of silicon nitride with resin bond diamond wheels[J]. Journal of Materials Processing Technology, 2003, 141(3): 329-336.
[95] Malkin S, Guo C. Grinding technology: theory and application of machining with abrasives[M]. Industrial Press Inc., 2008.
[96] Giannuzzi L A, Stevie F A. A review of focused ion beam milling techniques for TEM specimen preparation[J]. Micron, 1999, 30(3): 197-204.
[97] Izumi H, Kita T, Arai S, et al. The origin of fatigue fracture in single-crystal silicon[J]. Journal of Materials Science, 2022, 57(18): 8557-8566.
[98] Berendsen H J, Postma J van, Van Gunsteren W F, et al. Molecular dynamics with coupling to an external bath[J]. The Journal of chemical physics, 1984, 81(8): 3684-3690.
[99] Lee B, Rudd R E. First-principles study of the Young’s modulus of Si 〈001〉 nanowires[J]. Physical Review B, 2007, 75(4): 041305.
[100] Hauch J A, Holland D, Marder M P, et al. Dynamic Fracture in Single Crystal Silicon[J]. Physical Review Letters, 1999, 82(19): 3823-3826.
[101] Erhart P, Albe K. Analytical potential for atomistic simulations of silicon, carbon, and silicon carbide[J]. Physical Review B, 2005, 71(3): 035211.
[102] Agrawal P M, Raff L M, Komanduri R. Monte Carlo simulations of void-nucleated melting of silicon via modification in the Tersoff potential parameters[J]. Physical Review B, 2005, 72(12): 125206.
[103] Thompson A P, Plimpton S J, Mattson W. General formulation of pressure and stress tensor for arbitrary many-body interaction potentials under periodic boundary conditions[J]. The Journal of chemical physics, 2009, 131(15): 154107.
[104] Maras E, Trushin O, Stukowski A, et al. Global transition path search for dislocation formation in Ge on Si(001)[J]. Computer Physics Communications, 2016, 205: 13-21.
[105] Hansen J P, McDonald I R. Theory of simple liquids[J]. Physics Today, 1988, 41(10): 89-90.
[106] Wu Z, Liu W, Zhang L, et al. Amorphization and dislocation evolution mechanisms of single crystalline 6H-SiC[J]. Acta Materialia, 2020, 182: 60-67.
[107] Tsujino M, Sano T, Ozaki N, et al. Quenching of High-Pressure Phases of Silicon Using Femtosecond Laser-driven Shock Wave[J]. The Review of Laser Engineering, 2008, 36.
[108] Voronin G A, Pantea C, Zerda T W, et al. In situ x-ray diffraction study of silicon at pressures up to 15.5 GPa and temperatures up to 1073 K[J]. Physical Review B, 2003, 68(2): 020102.
[109] Bowden F P, Brunton J H, Field J E, et al. Controlled fracture of brittle solids and interruption of electrical current[J]. Nature, 1967, 216: 38-42.
[110] Molinari A. Collective behavior and spacing of adiabatic shear bands[J]. Journal of the Mechanics and Physics of Solids, 1997, 45(9): 1551-1575.
[111] Wright T W, Ockendon H. A scaling law for the effect of inertia on the formation of adiabatic shear bands[J]. International Journal of Plasticity, 1996, 12(7): 927-934.
[112] Nesterenko V F, Meyers M A, Wright T W. Self-organization in the initiation of adiabatic shear bands[J]. Acta Materialia, 1998, 46(1): 327-340.
[113] Lovinger Z, Rikanati A, Rosenberg Z, et al. Electro-magnetic collapse of thick-walled cylinders to investigate spontaneous shear localization[J]. International Journal of Impact Engineering, 2011, 38(11): 918-929.
[114] Shaw M C, Cookson J O. Metal cutting principles: Vol. 2[M]. New York: Oxford university, 2005.
[115] Longbottom J M, Lanham J D. A review of research related to Salomon’s hypothesis on cutting speeds and temperatures[J]. International Journal of Machine Tools and Manufacture, 2006, 46(14): 1740-1747.
[116] Davies M A, Ueda T, M’Saoubi R, et al. On The Measurement of Temperature in Material Removal Processes[J]. CIRP Annals, 2007, 56(2): 581-604.
[117] Ueda T, Hosokawa A, Yamada K. Effect of Oil Mist on Tool Temperature in Cutting[J]. Journal of Manufacturing Science and Engineering, 2005, 128(1): 130-135.
[118] Ranc N, Pina V, Sutter G, et al. Temperature Measurement by Visible Pyrometry: Orthogonal Cutting Application[J]. Journal of Heat Transfer, 2005, 126(6): 931-936.
[119] Sutter G, Faure L, Molinari A, et al. An experimental technique for the measurement of temperature fields for the orthogonal cutting in high speed machining[J]. International Journal of Machine Tools and Manufacture, 2003, 43(7): 671-678.
[120] Malkin S, Hwang T W. Grinding Mechanisms for Ceramics[J]. CIRP Annals, 1996, 45(2): 569-580.
[121] Yang M, Li C, Zhang Y, et al. Predictive model for minimum chip thickness and size effect in single diamond grain grinding of zirconia ceramics under different lubricating conditions[J]. Ceramics International, 2019, 45(12): 14908-14920.
[122] Zheng Z, Huang K, Lin C, et al. An analytical force and energy model for ductile-brittle transition in ultra-precision grinding of brittle materials[J]. International Journal of Mechanical Sciences, 2022, 220: 107107.
[123] Cotterell B, Rice J R. Slightly curved or kinked cracks[J]. International Journal of Fracture, 1980, 16(2): 155-169.
[124] Lankarani H M, Nikravesh P E. Continuous contact force models for impact analysis in multibody systems[J]. Nonlinear Dynamics, 1994, 5(2): 193-207.
[125] Hunt K H, Crossley F R E. Coefficient of Restitution Interpreted as Damping in Vibroimpact[J]. Journal of Applied Mechanics, 1975, 42(2): 440-445.
[126] Yi T, Li L, Kim C J. Microscale material testing of single crystalline silicon: process effects on surface morphology and tensile strength[J]. Sensors and Actuators A: Physical, 2000, 83(1): 172-178.
[127] Komanduri R, Schroeder T, Hazra J, et al. On the Catastrophic Shear Instability in High-Speed Machining of an AISI 4340 Steel[J]. Journal of Engineering for Industry, 1982, 104(2): 121-131.
[128] Ye G G, Xue S F, Jiang M Q, et al. Modeling periodic adiabatic shear band evolution during high speed machining Ti-6Al-4V alloy[J]. International Journal of Plasticity, 2013, 40: 39-55.
[129] Sutter G, Ranc N. Flash temperature measurement during dry friction process at high sliding speed[J]. Wear, 2010, 268(11-12): 1237-1242.
[130] Huang X, Ren Y, Zhou Z, et al. Experimental study on white layers in high-speed grinding of AISI52100 hardened steel[J]. Journal of Mechanical Science and Technology, 2015, 29(3): 1257-1263.
[131] Zhou L, Shimizu J, Muroya A, et al. Material removal mechanism beyond plastic wave propagation rate[J]. Precision Engineering, 2003, 27(2): 109-116.
[132] Wang B, Liu Z, Su G, et al. Investigations of critical cutting speed and ductile-to-brittle transition mechanism for workpiece material in ultra-high speed machining[J]. International Journal of Mechanical Sciences, 2015, 104: 44-59.
[133] Tersoff J. Chemical order in amorphous silicon carbide[J]. Physical Review B, 1994, 49(23): 16349.
[134] Fortner J, Lannin J S. Radial distribution functions of amorphous silicon[J]. Physical Review B, 1989, 39(8): 5527.
[135] Laaziri K, Kycia S, Roorda S, et al. High resolution radial distribution function of pure amorphous silicon[J]. Physical review letters, 1999, 82(17): 3460.
[136] Zhao S, Kad B, Hahn E N, et al. Pressure and shear-induced amorphization of silicon[J]. Extreme Mechanics Letters, 2015, 5: 74-80.
[137] Ye G G, Jiang M Q, Xue S F, et al. On the instability of chip flow in high-speed machining[J]. Mechanics of Materials, 2018, 116: 104-119.
[138] Xu Y, Zhang J, Bai Y, et al. Shear localization in dynamic deformation: microstructural evolution[J]. Metallurgical and materials transactions A, 2008, 39(4): 811-843.
[139] Sun K, Yu X, Tan C, et al. Effect of microstructure on adiabatic shear band bifurcation in Ti–6Al–4V alloys under ballistic impact[J]. Materials Science and Engineering: A, 2014, 595: 247-256.
[140] Yang Y, Jiang L. Self-organization of adiabatic shear bands in ZK60 Magnesium alloy[J]. Materials Science and Engineering: A, 2016, 655: 321-330.
[141] Zhao S, Hahn E N, Kad B, et al. Amorphization and nanocrystallization of silicon under shock compression[J]. Acta Materialia, 2016, 103: 519-533.
[142] Melosh H J. Impact cratering : a geologic process[M]//New York : Oxford University Press ; Oxford : Clarendon Press. 1989.
[143] Murr L E, A. Quinones S, Ferreyra T E, et al. The low-velocity-to-hypervelocity penetration transition for impact craters in metal targets[J]. Materials Science and Engineering: A, 1998, 256(1): 166-182.
[144] Goto T, Sato T, Syono Y. Reduction of shear strength and phase-transition in shock-loaded silicon[J]. Japanese Journal of Applied Physics, 1982, 21(6A): L369.
[145] Gust W H, Royce E B. Axial yield strengths and two successive phase transition stresses for crystalline silicon[J]. Journal of Applied Physics, 1971, 42(5): 1897-1905.
[146] Gao H, Huang Y, Nix W D, et al. Mechanism-based strain gradient plasticity— I. Theory[J]. Journal of the Mechanics and Physics of Solids, 1999, 47(6): 1239-1263.