New approach to achieve extremely high thermal conductivity of a powder extruded Al–50Si alloy

Ding，Chao1,2; Ma，Rui3; Ye，Changqing1; Li，Shukui1; Lu，Zhouguang2; Yu，Changyang2; Yu，Peng4; Yang，Weimin5; Ye，Shulong1

2024-03-01

10.1016/j.jmrt.2024.01.146

Journal of Materials Research and Technology   影响因子和分区

2238-7854

The Al–50Si alloy, designed for effective heat dissipation in electronic components, was subjected to a two-stage heat treatment process to optimize its microstructure and achieve high thermal conductivity (TC). Two distinct temperature stages were strategically chosen: 850 °C and 550 °C, respectively, with the former operating above and the latter below the eutectic point. The first stage at 850 °C led to the isolation of independent Si particles, each closely associated with individual Al crystal with grain size of approximately 1 mm. Subsequent heat treatment at 550 °C skillfully eliminated introduced eutectic Si through Ostwald ripening. Consequently, the impediments posed by grain boundaries to the movement of electrons and phonons were significantly reduced, yielding an exceptionally high TC of approximately 180 WmK, closely approaching the theoretical TC value (∼193 WmK) for the Al–50Si alloy. This work paved a new path for the design of outstanding thermal properties in Al–Si electronic packaging materials.

Al-50Si alloy Heat treatment Microstructure Thermal conductivity

SCI ; EI

英语

其他

2-s2.0-85182925090

Scopus

1.Faculty of Materials Science,Shenzhen MSU-BIT University,Shenzhen,518172,China
2.Department of Materials Science and Engineering,Southern University of Science and Technology,Shenzhen,518055,China
3.Postdoctoral Programme,Guosen Securities Co.,Ltd.,Shenzhen,518048,China
4.Shenzhen ElementPlus Material Technology Co.,Ltd.,Shenzhen,518107,China
5.Physics Labotory,Industrial Training Center,Shenzhen Polytechnic University,Shenzhen,518055,China

Ding，Chao,Ma，Rui,Ye，Changqing,等. New approach to achieve extremely high thermal conductivity of a powder extruded Al–50Si alloy[J]. Journal of Materials Research and Technology,2024,29:609-615.

Ding，Chao.,Ma，Rui.,Ye，Changqing.,Li，Shukui.,Lu，Zhouguang.,...&Ye，Shulong.(2024).New approach to achieve extremely high thermal conductivity of a powder extruded Al–50Si alloy.Journal of Materials Research and Technology,29,609-615.

Ding，Chao,et al."New approach to achieve extremely high thermal conductivity of a powder extruded Al–50Si alloy".Journal of Materials Research and Technology 29(2024):609-615.