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题名

Integrated Sensing and Communications: Recent Advances and Ten Open Challenges

作者
通讯作者Liu,Fan
发表日期
2024
DOI
发表期刊
ISSN
2372-2541
EISSN
2327-4662
卷号PP期号:99页码:1-1
摘要

It is anticipated that integrated sensing and communications (ISAC) would be one of the key enablers of next-generation wireless networks (such as beyond 5G (B5G) and 6G) for supporting a variety of emerging applications. In this paper, we provide a comprehensive review of the recent advances in ISAC systems, with a particular focus on their foundations, physical-layer system design, networking aspects and ISAC applications. Furthermore, we discuss the corresponding open questions of the above that emerged in each issue. Hence, we commence with the information theory of sensing and communications (S&C), followed by the information-theoretic limits of ISAC systems by shedding light on the fundamental performance metrics. Next, we discuss their clock synchronization and phase offset problems, the associated Pareto-optimal signaling strategies, as well as the associated super-resolution physical-layer ISAC system design. Moreover, we envision that ISAC ushers in a paradigm shift for the future cellular networks relying on network sensing, transforming the classic cellular architecture, cross-layer resource management methods, and transmission protocols. In ISAC applications, we further highlight the security and privacy issues of wireless sensing. Finally, we close by studying the recent advances in a representative ISAC use case, namely the multi-object multi-task (MOMT) recognition problem using wireless signals.

关键词
相关链接[Scopus记录]
收录类别
SCI ; EI
语种
英语
学校署名
第一 ; 通讯
来源库
IEEE
全文链接https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10418473
引用统计
被引频次[WOS]:29
成果类型期刊论文
条目标识符http://sustech.caswiz.com/handle/2SGJ60CL/701661
专题工学院_系统设计与智能制造学院
作者单位
1.School of System Design and Intelligent Manufacturing (SDIM), Southern University of Science and Technology, Shenzhen, China
2.Department of Electrical and Electronic Engineering, The Hong Kong Polytechnic University, Hong Kong, China
3.School of Information and Communication Engineering, Beijing University of Posts and Telecommunications, Beijing, China
4.School of Information Science and Engineering, Southeast University, Nanjing, China
5.Collective Intelligence and Collaboration Laboratory, China North Artificial Intelligence and Innovation Research Institute, Beijing, China
6.School of Electronics and Computer Science, University of Southampton, Southampton, U.K
第一作者单位系统设计与智能制造学院
通讯作者单位系统设计与智能制造学院
第一作者的第一单位系统设计与智能制造学院
推荐引用方式
GB/T 7714
Lu,Shihang,Liu,Fan,Li,Yunxin,et al. Integrated Sensing and Communications: Recent Advances and Ten Open Challenges[J]. IEEE Internet of Things Journal,2024,PP(99):1-1.
APA
Lu,Shihang.,Liu,Fan.,Li,Yunxin.,Zhang,Kecheng.,Huang,Hongjia.,...&Hanzo,Lajos.(2024).Integrated Sensing and Communications: Recent Advances and Ten Open Challenges.IEEE Internet of Things Journal,PP(99),1-1.
MLA
Lu,Shihang,et al."Integrated Sensing and Communications: Recent Advances and Ten Open Challenges".IEEE Internet of Things Journal PP.99(2024):1-1.
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