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题名

Modeling the Performance and Reliability of Two-Dimensional Semiconductor Transistors

作者
通讯作者M.R. Davoudi
DOI
发表日期
2023-12
会议名称
2023 International Electron Devices Meeting (IEDM)
ISSN
0163-1918
ISBN
979-8-3503-2768-7
会议录名称
页码
1-4
会议日期
9-13 December 2023
会议地点
San-Francisco, USA
出版者
摘要

Two-dimensional (2D) semiconductors offer good mobilities and high drive currents in atomically thin layers, thereby enabling excellent gate control in ultra-short channel devices. However, numerous challenges must be overcome for 2D materials to be used in commercial applications, including the formation of contacts and the identification of scalable and reliable gate insulators. To enable the transition from prototype devices to integrated circuits at an industrial scale, physical predictive modeling tools are required for 2D transistors. Here we show, based on three different device examples, how TCAD and compact models can be used to describe the performance and reliability of 2D transistors. We investigate two device types based on MoS 2 using SiO 2 as the gate insulator and one based on the novel tertiary layered zipper material Bi 2 O 2 Se and its native oxide Bi 2 SeO 5 . We use our models to benchmark the device performance and offer valuable insights into transistor operation, thereby revealing promising approaches for performance improvements.

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全文链接https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10413824
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成果类型会议论文
条目标识符http://sustech.caswiz.com/handle/2SGJ60CL/702042
专题南方科技大学
工学院_材料科学与工程系
作者单位
1.TU Wien
2.Peking University
3.Stanford University
4.Huawei Technologies R&D
5.Southern University of Science and Technology
6.imec
推荐引用方式
GB/T 7714
T. Knobloch,D. Waldhoer,M.R. Davoudi,et al. Modeling the Performance and Reliability of Two-Dimensional Semiconductor Transistors[C]:IEEE Xplore,2023:1-4.
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