南方科技大学知识苑(SUSTech KC): Preparation of Ultrafine Copper Powder by Reduction of Cupric Oxide with Ascorbic Acid

题名	Preparation of Ultrafine Copper Powder by Reduction of Cupric Oxide with Ascorbic Acid
作者	Xie, Bingqing 1,2,3; Ke, Xin 1,2,3; Ban, Liqing 1,2; Wang, Zhong 1,2; Zhang, Jingguo 1,2,4; Ye, Huaiyu5 ; Wang, Jianwei 1,6; Li, Zhanrong 1,2,4; Hu, Qiang 1,2; He, Huijun 1,2; Wang, Limin 1,2
DOI	10.1109/SSLChinaIFWS60785.2023.10399762
发表日期	2023
会议名称	20th China International Forum on Solid State Lighting and 9th International Forum on Wide Bandgap Semiconductors, SSLCHINA: IFWS 2023
ISBN	9798350385373
会议录名称	2023 20th China International Forum on Solid State Lighting and 2023 9th International Forum on Wide Bandgap Semiconductors, SSLCHINA: IFWS 2023
页码	144-148
会议日期	November 27, 2023 - November 30, 2023
会议地点	Xiamen, Fujian, China
出版者	Institute of Electrical and Electronics Engineers Inc.
摘要	Ultrafine copper powder with uniform particle size and good dispersion was prepared in aqueous solution using copper oxide as precursor, ascorbic acid as reducing agent, polyvinyl pyrrolidone as dispersing agent by liquid phase reduction. The average particle size of the obtained copper powder was 1.78 μm and the tapped density was 4.07 g /cm³. The effects of pH and polyvinyl pyrrolidone concentration on the morphology and particle size of ultrafine copper powder were studied. © 2023 IEEE.
关键词	Powders Liquids Photonic band gap Morphology Copper Dispersion
学校署名	其他
语种	英语
相关链接	[IEEE记录]
收录类别	EI
资助项目	This study was supported by the Chongqing Municipal Technology Innovation and Application Development Special Key Project (CSTB2022TIAD-KPX0027), and the National Key R&D Program of the Ministry of Science and Technology (2018YFE0204600)
EI入藏号	20240715542970
EI主题词	Copper oxides ; Copper powder ; Particle size
EI分类号	Copper:544.1 ; Organic Compounds:804.1 ; Inorganic Compounds:804.2
来源库	EV Compendex
全文链接	https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10399762
引用统计
成果类型	会议论文
条目标识符	http://sustech.caswiz.com/handle/2SGJ60CL/706369
专题	南方科技大学
作者单位	1.Metal Powder Materials Industrial Technology Research Institute of China Grinm, Beijing; 101407, China 2.Gripm Advanced Materials Co. Ltd., Beijing; 101407, China 3.General Research Institute for Nonferrous Metals, Beijing; 100088, China 4.Gricy Advanced Materials Co., Ltd., Chongqing; 401431, China 5.Shenzhen Institute of Wide-bandgap Semiconductors, Southern University of Science and Technology, Shenzhen; 518055, China 6.Grinm Nexusx Advanced Materials(Beijing) Co. Ltd., Beijing; 101407, China
推荐引用方式 GB/T 7714	Xie, Bingqing,Ke, Xin,Ban, Liqing,et al. Preparation of Ultrafine Copper Powder by Reduction of Cupric Oxide with Ascorbic Acid[C]:Institute of Electrical and Electronics Engineers Inc.,2023:144-148.