南方科技大学知识苑(SUSTech KC): Mechanical simulation and debonding risk analysis of OLED panels with optically clear adhesives

题名	Mechanical simulation and debonding risk analysis of OLED panels with optically clear adhesives
作者	Jinrui,Cao; Abuzar,Es’haghioskui; Peng,Dong; Zhi,Gong; Hongyan,Yuan
通讯作者	Hongyan,Yuan
发表日期	2024-07
DOI	10.1016/j.displa.2024.102722
发表期刊	Displays 影响因子和分区
ISSN	0141-9382
卷号	83页码:102722
摘要	This paper presents a mechanical simulation model and analysis method for OLED panels. The functional layers within the panel are bonded using optically clear adhesives (OCAs), which are pressure-sensitive adhesives (PSAs), resulting in a soft interface bonding problem. It was discovered that the normal tensile debonding strength of OCAs was significantly lower than the shear debonding strength. To address this issue, a three-layer structure simulation model of “hard + soft + hard” is established, which allows for analyzing the screen folding problem of any radius. Additionally, a suitable element mesh generation strategy for multi-layer structure screens is proposed. A debonding risk index based on pressure is introduced by comparing the interlaminar normal and maximum principal stress. The influence of thickness, bending radius, and Young's modulus on longitudinal stress and debonding risk index is examined. It is observed that the influence of thickness and Young's modulus on debonding risk is non-monotonic, indicating the presence of an optimal solution. The high debonding risk area is located at the beginning of the folding mechanism and screen bonding. The proposed debonding risk index is not only applicable to OCAs but also to all PSA with similar structures.
关键词	Debonding Mechanical simulation OLED panels Optically clear adhesives Stress analysis
相关链接	[来源记录]
收录类别	SCI ; EI
语种	英语
学校署名	第一 ; 通讯
出版者	Elsevier BV
EI入藏号	20241715963462
EI主题词	Adhesives ; Debonding ; Elastic moduli ; Mesh generation ; Organic light emitting diodes (OLED) ; Risk analysis ; Risk assessment
EI分类号	Semiconductor Devices and Integrated Circuits:714.2 ; Computer Applications:723.5 ; Accidents and Accident Prevention:914.1 ; Combinatorial Mathematics, Includes Graph Theory, Set Theory:921.4 ; Statistical Methods:922 ; Materials Science:951
ESI学科分类	COMPUTER SCIENCE
Scopus记录号	2-s2.0-85190836454
来源库	人工提交
引用统计	被引频次[WOS]：1
成果类型	期刊论文
条目标识符	http://sustech.caswiz.com/handle/2SGJ60CL/745715
专题	工学院_力学与航空航天工程系
作者单位	Shenzhen Key Laboratory of Soft Mechanics & Smart Manufacturing, Department of Mechanics and Aerospace Engineering, Southern University of Science and Technology, Shenzhen 518055, China
第一作者单位	力学与航空航天工程系
通讯作者单位	力学与航空航天工程系
第一作者的第一单位	力学与航空航天工程系
推荐引用方式 GB/T 7714	Jinrui,Cao,Abuzar,Es’haghioskui,Peng,Dong,et al. Mechanical simulation and debonding risk analysis of OLED panels with optically clear adhesives[J]. Displays,2024,83:102722.
APA	Jinrui,Cao,Abuzar,Es’haghioskui,Peng,Dong,Zhi,Gong,&Hongyan,Yuan.(2024).Mechanical simulation and debonding risk analysis of OLED panels with optically clear adhesives.Displays,83,102722.
MLA	Jinrui,Cao,et al."Mechanical simulation and debonding risk analysis of OLED panels with optically clear adhesives".Displays 83(2024):102722.