改性环氧树脂封装基板的固化动力学研究和性能优化

随着半导体封装技术朝着高密度、小型化的方向发展，封装基板的厚度越来越薄，基板的翘曲、热稳定性等可靠性问题变得越来越重要，调整基板性能、采用有限元仿真建模是有效的解决方案。本研究考察了不同固化温度下改性环氧树脂封装基板的热机械性能、力学性能、介电性能，以及性能变化趋势。并通过固化动力学研究了基板的固化表现。最后结合实际案例，基于有限元仿真，研究了影响基板翘曲的材料尺寸因素，建立的仿真模型能够有效预测基板翘曲和探究基板翘曲的影响因素。主要内容如下：

本研究以改性环氧树脂半固化片为原料，通过200-250℃固化温度真空热压工艺制备改性环氧树脂封装基板。研究结果表明，固化温度对封装基板的热膨胀系数和弯曲模量有一定影响；基板在高温下的储存模量和弯曲强度随固化温度升高而增大，在250℃固化温度下，基板的高温储存模量（260℃）达到15 GPa，240℃固化的基板有最大的弯曲强度值398 MPa；基板的介电损耗随固化温度的升高而增加，较高的固化温度不利于基板介电性能的提升；红外光谱的结果表明，在200-250℃固化温度下基板树脂的固化程度一致；固化动力学分析表明，基板树脂固化反应在60%-95%的固化程度范围，活化能从80 kJ/mol增加到130 kJ/mol，反应更加受扩散控制；通过动力学预测预测了不同固化条件下的固化表现。

基于有限元软件ABAQUS搭建了裸载板模型，探究了基板材料、基板固化温度、阻焊油材料尺寸和种类对裸载板降温后翘曲的影响。仿真结果表明，在裸载板降温的过程中，商业化的两种基板均表现为较高的翘曲值，分别为8.977 mm和5.025 mm；固化温度对基板翘曲有一定影响，翘曲的差异由不同固化温度对基板X/Y向CTE的影响所致，然而基板较高的CTE不利于后续工艺；Solder Mask 的应用可以帮助纠正翘曲。通过调整上下表面阻焊油层厚度，将基板-1的翘曲值降低至1mm以下，在保证了基板较低CTE的同时有更低的翘曲。此外，不同阻焊油材料对基板翘曲有一定影响。

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