基于巯基-烯光点击反应的有机硅临时键合材料的制备及其性能研究

本研究致力于解决超薄晶圆加工过程中因机械性能下降导致的破片问 题，特别针对现有临时键合材料无法满足半导体加工高温需求的挑战。为 此，我们提出并实施了采用巯基-烯有机硅材料开发高耐热型临时键合粘结 层的创新策略。 在研究过程中，利用巯基-烯体系开发出了具有优异高温性能的临时键 合粘结层。通过对合成产物巯基硅油的详细分析，我们验证了其结构，并 深入研究了其分子量、粘度等关键性能指标。进一步，我们将该材料制备 成胶，并对其反应速率、热稳定性、粘结强度等性能进行了全面评估，由 此得到了综合性 能 优异的 临时键合 材 料。该临时键合材 料 Td ,5%值高于 447 ℃，满足高温制程要求，并在三层模型的临时键合与解键合工艺中得 到验证。 在带有释放层的四层模型中，我们成功攻克了机械解键合过程中残胶 黏附的难题。通过调节添加剂的配比，并优化后烘烤工艺，我们实现了键 合对的高效分离，从而避免了繁琐的清洗步骤。此外，我们还成功通过了 激光解键合的验证，并且利用正涂工艺的紫外激光解键合也取得了良好的 验证结果，充分证明了其在实际应用中的可行性。 针对减薄过程中出现的边缘小破碎现象，我们进行了深入研究。通过 增加乙烯基含量和引入刚性基团，我们成功提升了材料的杨氏模量，从而 改善了其机械性能。最终，我们成功开发出高模量有机硅临时键合材料， 杨氏模量达 28.56 MPa，并通过临时键合与解键合工艺验证了其优异性能。 本研究取得了一系列创新性成果，不仅为超薄晶圆加工提供了有效的 技术支持，也为半导体行业的持续发展做出了积极贡献。

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