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题名

Large strain mechanical behaviors of optically clear adhesives for flexible electronic devices under different temperature, humidity, and strain rates

作者
通讯作者Yuan, Hongyan
发表日期
2024-06-01
DOI
发表期刊
ISSN
0021-8995
EISSN
1097-4628
摘要
["Optically clear adhesives (OCAs), a type of polymer pressure-sensitive adhesive, are valued for their transparency, strong bonding, thermal stability, and reliability in flexible electronics. Accurately determining the mechanical properties of OCAs is importance for effectively assessing the structural integrity of foldable screens in finite element simulations. However, previous studies have primarily focused on small strain and conventional environmental conditions. To address this gap, the present study investigates the mechanical behaviors of OCAs under extreme conditions, including large strain (up to 1000%), high/low temperatures (-40, -20, 0, 25, 65, and 80 degrees C), and high humidity (95% relative humidity). Specifically, the tensile, simple shear, and creep properties of OCAs have been assessed in an attempt to explore their visco-hyperelastic behavior. The experimental findings indicate that OCA exhibits noticeable temperature sensitivity and viscoelasticity, along with volume-incompressible properties. Notably, when the temperature is varied from -40 to 25 degrees C and from 25 to 80 degrees C, the modulus of OCA experiences an average reduction of 84% and 41% respectively. Moreover, it has been observed that humidity has a negligible effect on the material's modulus. The Yeoh model and Prony series are employed for fitting purposes. The proposed fitting parameters are subsequently validated through numerical simulations of three-point bending case studies. Remarkably, the simulation results closely matched with the experimental data, with errors remaining below 10%.","Large strain mechanical behaviors of optically clear adhesives for flexible electronic devices under different temperature, humidity, and strain rates. image"]
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相关链接[来源记录]
收录类别
语种
英语
学校署名
第一 ; 通讯
资助项目
Science, Technology and Innovation Commission of Shenzhen Municipality[ZDSYS20210623092005017] ; null[12072143]
WOS研究方向
Polymer Science
WOS类目
Polymer Science
WOS记录号
WOS:001243529900001
出版者
ESI学科分类
CHEMISTRY
来源库
Web of Science
引用统计
成果类型期刊论文
条目标识符http://sustech.caswiz.com/handle/2SGJ60CL/788028
专题工学院_力学与航空航天工程系
作者单位
1.Southern Univ Sci & Technol, Dept Mech & Aerosp Engn, Shenzhen Key Lab Soft Mech & Smart Mfg, Shenzhen 518055, Peoples R China
2.Virginia Tech, Dept Mech Engn, Blacksburg, VA USA
第一作者单位力学与航空航天工程系
通讯作者单位力学与航空航天工程系
第一作者的第一单位力学与航空航天工程系
推荐引用方式
GB/T 7714
Cao, Jinrui,Es'haghioskui, Abuzar,Sadeghzade, Sorour,et al. Large strain mechanical behaviors of optically clear adhesives for flexible electronic devices under different temperature, humidity, and strain rates[J]. JOURNAL OF APPLIED POLYMER SCIENCE,2024.
APA
Cao, Jinrui.,Es'haghioskui, Abuzar.,Sadeghzade, Sorour.,Li, Yuanlong.,Huang, Zhaoyan.,...&Yuan, Hongyan.(2024).Large strain mechanical behaviors of optically clear adhesives for flexible electronic devices under different temperature, humidity, and strain rates.JOURNAL OF APPLIED POLYMER SCIENCE.
MLA
Cao, Jinrui,et al."Large strain mechanical behaviors of optically clear adhesives for flexible electronic devices under different temperature, humidity, and strain rates".JOURNAL OF APPLIED POLYMER SCIENCE (2024).
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