题名 | Large strain mechanical behaviors of optically clear adhesives for flexible electronic devices under different temperature, humidity, and strain rates |
作者 | |
通讯作者 | Yuan, Hongyan |
发表日期 | 2024-06-01
|
DOI | |
发表期刊 | |
ISSN | 0021-8995
|
EISSN | 1097-4628
|
摘要 | ["Optically clear adhesives (OCAs), a type of polymer pressure-sensitive adhesive, are valued for their transparency, strong bonding, thermal stability, and reliability in flexible electronics. Accurately determining the mechanical properties of OCAs is importance for effectively assessing the structural integrity of foldable screens in finite element simulations. However, previous studies have primarily focused on small strain and conventional environmental conditions. To address this gap, the present study investigates the mechanical behaviors of OCAs under extreme conditions, including large strain (up to 1000%), high/low temperatures (-40, -20, 0, 25, 65, and 80 degrees C), and high humidity (95% relative humidity). Specifically, the tensile, simple shear, and creep properties of OCAs have been assessed in an attempt to explore their visco-hyperelastic behavior. The experimental findings indicate that OCA exhibits noticeable temperature sensitivity and viscoelasticity, along with volume-incompressible properties. Notably, when the temperature is varied from -40 to 25 degrees C and from 25 to 80 degrees C, the modulus of OCA experiences an average reduction of 84% and 41% respectively. Moreover, it has been observed that humidity has a negligible effect on the material's modulus. The Yeoh model and Prony series are employed for fitting purposes. The proposed fitting parameters are subsequently validated through numerical simulations of three-point bending case studies. Remarkably, the simulation results closely matched with the experimental data, with errors remaining below 10%.","Large strain mechanical behaviors of optically clear adhesives for flexible electronic devices under different temperature, humidity, and strain rates. image"] |
关键词 | |
相关链接 | [来源记录] |
收录类别 | |
语种 | 英语
|
学校署名 | 第一
; 通讯
|
资助项目 | Science, Technology and Innovation Commission of Shenzhen Municipality[ZDSYS20210623092005017]
; null[12072143]
|
WOS研究方向 | Polymer Science
|
WOS类目 | Polymer Science
|
WOS记录号 | WOS:001243529900001
|
出版者 | |
ESI学科分类 | CHEMISTRY
|
来源库 | Web of Science
|
引用统计 | |
成果类型 | 期刊论文 |
条目标识符 | http://sustech.caswiz.com/handle/2SGJ60CL/788028 |
专题 | 工学院_力学与航空航天工程系 |
作者单位 | 1.Southern Univ Sci & Technol, Dept Mech & Aerosp Engn, Shenzhen Key Lab Soft Mech & Smart Mfg, Shenzhen 518055, Peoples R China 2.Virginia Tech, Dept Mech Engn, Blacksburg, VA USA |
第一作者单位 | 力学与航空航天工程系 |
通讯作者单位 | 力学与航空航天工程系 |
第一作者的第一单位 | 力学与航空航天工程系 |
推荐引用方式 GB/T 7714 |
Cao, Jinrui,Es'haghioskui, Abuzar,Sadeghzade, Sorour,et al. Large strain mechanical behaviors of optically clear adhesives for flexible electronic devices under different temperature, humidity, and strain rates[J]. JOURNAL OF APPLIED POLYMER SCIENCE,2024.
|
APA |
Cao, Jinrui.,Es'haghioskui, Abuzar.,Sadeghzade, Sorour.,Li, Yuanlong.,Huang, Zhaoyan.,...&Yuan, Hongyan.(2024).Large strain mechanical behaviors of optically clear adhesives for flexible electronic devices under different temperature, humidity, and strain rates.JOURNAL OF APPLIED POLYMER SCIENCE.
|
MLA |
Cao, Jinrui,et al."Large strain mechanical behaviors of optically clear adhesives for flexible electronic devices under different temperature, humidity, and strain rates".JOURNAL OF APPLIED POLYMER SCIENCE (2024).
|
条目包含的文件 | 条目无相关文件。 |
|
除非特别说明,本系统中所有内容都受版权保护,并保留所有权利。
修改评论