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题名

Superionic fluoride gate dielectrics with low diffusion barrier for two-dimensional electronics

作者
通讯作者Yang, Yurong; Xue, Qi-Kun; Cui, Yi; Yuan, Hongtao
发表日期
2024-05-01
DOI
发表期刊
ISSN
1748-3387
EISSN
1748-3395
卷号19页码:932-940
摘要
Exploration of new dielectrics with a large capacitive coupling is an essential topic in modern electronics when conventional dielectrics suffer from the leakage issue near the breakdown limit. Here, to address this looming challenge, we demonstrate that rare-earth metal fluorides with extremely low ion migration barriers can generally exhibit an excellent capacitive coupling over 20 mu F cm(-2) (with an equivalent oxide thickness of similar to 0.15 nm and a large effective dielectric constant near 30) and great compatibility with scalable device manufacturing processes. Such a static dielectric capability of superionic fluorides is exemplified by MoS2 transistors exhibiting high on/off current ratios over 10(8), ultralow subthreshold swing of 65 mV dec(-1) and ultralow leakage current density of similar to 10(-6) A cm(-2). Therefore, the fluoride-gated logic inverters can achieve notably higher static voltage gain values (surpassing similar to 167) compared with a conventional dielectric. Furthermore, the application of fluoride gating enables the demonstration of NAND, NOR, AND and OR logic circuits with low static energy consumption. In particular, the superconductor-insulator transition at the clean-limit Bi2Sr2CaCu2O8+delta can also be realized through fluoride gating. Our findings highlight fluoride dielectrics as a pioneering platform for advanced electronic applications and for tailoring emergent electronic states in condensed matter.
相关链接[来源记录]
收录类别
SCI ; EI
语种
英语
学校署名
通讯
资助项目
National Natural Science Foundation of China (National Science Foundation of China)["92365203","52072168"] ; National Natural Science Foundation of China[2021YFA1202901] ; US Department of Energy, Office of Basic Energy Sciences[DE-AC02-76SF00515]
WOS研究方向
Science & Technology - Other Topics ; Materials Science
WOS类目
Nanoscience & Nanotechnology ; Materials Science, Multidisciplinary
WOS记录号
WOS:001223853900002
出版者
EI入藏号
20242016101603
EI主题词
Calcium compounds ; Computer circuits ; Copper compounds ; Dielectric materials ; Diffusion barriers ; Energy utilization ; Gate dielectrics ; Layered semiconductors ; Molybdenum compounds ; Rare earths ; Strontium compounds ; Transition metals
EI分类号
Energy Utilization:525.3 ; Metallurgy and Metallography:531 ; Dielectric Materials:708.1 ; Semiconducting Materials:712.1 ; Semiconductor Devices and Integrated Circuits:714.2 ; Computer Circuits:721.3 ; Inorganic Compounds:804.2
来源库
Web of Science
引用统计
被引频次[WOS]:3
成果类型期刊论文
条目标识符http://sustech.caswiz.com/handle/2SGJ60CL/788451
专题理学院_物理系
作者单位
1.Nanjing Univ, Coll Engn & Appl Sci, Jiangsu Key Lab Artificial Funct Mat, Natl Lab Solid State Microstruct, Nanjing, Peoples R China
2.Nanjing Univ, Collaborat Innovat Ctr Adv Microstruct, Nanjing, Peoples R China
3.Tsinghua Univ, State Key Lab Low Dimens Quantum Phys, Beijing, Peoples R China
4.Tsinghua Univ, Dept Phys, Beijing, Peoples R China
5.Brookhaven Natl Lab, Condensed Matter Phys & Mat Sci Dept, Upton, NY USA
6.SLAC Natl Accelerator Lab, Stanford Inst Mat & Energy Sci, Menlo Pk, CA 94025 USA
7.Stanford Univ, Geballe Lab Adv Mat, Stanford, CA 94305 USA
8.Stanford Univ, Dept Appl Phys, Stanford, CA USA
9.Southern Univ Sci & Technol, Dept Phys, Shenzhen, Peoples R China
10.Stanford Univ, Dept Mat Sci & Engn, Stanford, CA 94305 USA
通讯作者单位物理系
推荐引用方式
GB/T 7714
Meng, Kui,Li, Zeya,Chen, Peng,et al. Superionic fluoride gate dielectrics with low diffusion barrier for two-dimensional electronics[J]. NATURE NANOTECHNOLOGY,2024,19:932-940.
APA
Meng, Kui.,Li, Zeya.,Chen, Peng.,Ma, Xingyue.,Huang, Junwei.,...&Yuan, Hongtao.(2024).Superionic fluoride gate dielectrics with low diffusion barrier for two-dimensional electronics.NATURE NANOTECHNOLOGY,19,932-940.
MLA
Meng, Kui,et al."Superionic fluoride gate dielectrics with low diffusion barrier for two-dimensional electronics".NATURE NANOTECHNOLOGY 19(2024):932-940.
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