Improving Electromigration Resistance of Fine-Pitch Redistributed Layer Using Graphene-Doped Twinned Copper Composites

Shi, Zixiang1,2; Wang, Zesong1,3; Gao, Li-Yin1,2,3,4; Zhong, Cheng1; Li, Peifeng1,3; Liu, Zhi-Quan1,2,3,4; Sun, Rong1

2024-03-01

10.1002/adem.202301649

ADVANCED ENGINEERING MATERIALS   影响因子和分区

1438-1656

1527-2648

["The electromigration (EM) behavior of graphene-doped twinned copper composite (GC-Cu) and nanotwinned copper (NT-Cu) redistributed layers (RDLs) are investigated. Firstly, the GC-Cu has longer lifetimes under various test conditions. For example, the GC-Cu RDL took 291 h to reach a 20% resistance increase, while the NT-Cu RDL took 117 h under the same condition of 120 degrees C and 106 A cm-2. Secondly, thinner oxidation layer and slighter voiding phenomena are detected on GC-Cu RDLs. When the line width and spacing (L/S) of RDL decreased from 20/20 mu m to 10/10 mu m, new failure modes, i.e., fracture of oxide layer, separation between the oxide layer and copper matrix are also detected, demonstrating the increasing thermal mismatch. Combined with the finite element analysis (FEA), there is simultaneous current aggregation and stress concentration around the voids, which should further cause the degradation of RDL. Above all, this study gives insights into the material design in the fine-pitch RDL structure.","The electromigration (EM) resistance of three different copper redistributed layers (RDLs), including nanotwinned copper (NT-Cu) and graphene-doped copper composite (GC-Cu) are compared. The result reveals that both increasing twin density and adding graphene can improve the EM performance. Especially, the GC-Cu have longer lifetimes, thinner oxidation layers, and slighter voiding phenomena.image (c) 2024 WILEY-VCH GmbH"]

composite film electromigration graphene nanotwinned copper redistributed layer

SCI ; EI

英语

通讯

Guangdong Basic and Applied Basic Research Foundation[2022B1515120037] ; null[62274172] ; null[62104243]

Materials Science

Materials Science, Multidisciplinary

WOS:001173804700001

WILEY-V C H VERLAG GMBH

MATERIALS SCIENCE

Web of Science

1.Chinese Acad Sci, Shenzhen Inst Adv Technol, Shenzhen Inst Adv Elect Mat, Shenzhen 518055, Peoples R China
2.Univ Sci & Technol China, Nano Sci & Technol Inst, Suzhou 215213, Peoples R China
3.Southern Univ Sci & Technol, Coll Engn, Shenzhen 518055, Peoples R China
4.Univ Chinese Acad Sci, Shenzhen Coll Adv Technol, Shenzhen 518055, Peoples R China

Shi, Zixiang,Wang, Zesong,Gao, Li-Yin,et al. Improving Electromigration Resistance of Fine-Pitch Redistributed Layer Using Graphene-Doped Twinned Copper Composites[J]. ADVANCED ENGINEERING MATERIALS,2024,26(6).

Shi, Zixiang.,Wang, Zesong.,Gao, Li-Yin.,Zhong, Cheng.,Li, Peifeng.,...&Sun, Rong.(2024).Improving Electromigration Resistance of Fine-Pitch Redistributed Layer Using Graphene-Doped Twinned Copper Composites.ADVANCED ENGINEERING MATERIALS,26(6).

Shi, Zixiang,et al."Improving Electromigration Resistance of Fine-Pitch Redistributed Layer Using Graphene-Doped Twinned Copper Composites".ADVANCED ENGINEERING MATERIALS 26.6(2024).