| 题名 | Multi Physics Simulation of Wafer Bonding with Nano Copper Paste |
| 作者 | |
| DOI | |
| 发表日期 | 2024-04-10
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| ISSN | 2833-8553
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| ISBN | 979-8-3503-9364-4
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| 会议录名称 | |
| 会议日期 | 7-10 April 2024
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| 会议地点 | Catania, Italy
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| 摘要 | The significance of wafer bonding is fundamental to the progression of electronic systems. Common fabrication techniques for Cu pillars play a crucial role in establishing resilient and efficient interconnects within semiconductor devices. It is imperative to explore the potential of nano-copper as an alternative material to overcome limitations associated with conventional copper. The use of nano copper paste in manufacturing has the potential to simplify the process, potentially reducing the number of steps compared to conventional methods. This study delves into the intricacies of wafer-level packaging (WLP), with a particular focus on hybrid bonding processes utilizing nanocopper sintering. Through the application of Finite Element Method (FEM) simulations, we investigate the stress distribution and thermal dynamics inherent in the sintering and hybrid bonding of both bulk copper and nanocopper materials. Our findings illuminate the superior mechanical and thermal properties of nanocopper, which contribute to reduced stress concentrations and enhanced mechanical integrity in semiconductor packaging. The research highlights the pivotal role of nanocopper sintering in advancing WLP technologies, offering insights into optimizing sintering and bonding parameters for improved device reliability and performance. |
| 学校署名 | 第一
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| 相关链接 | [IEEE记录] |
| 收录类别 | |
| 引用统计 | |
| 成果类型 | 会议论文 |
| 条目标识符 | http://sustech.caswiz.com/handle/2SGJ60CL/789096 |
| 专题 | 工学院_深港微电子学院 |
| 作者单位 | 1.School of Microelectronics, Southern University of Science and Technology, Shenzhen, China 2.Department of Microelectronics, Delft University of Technology, Delft, the Netherlands 3.Pingxi Preparatory Team, Sky Chip Interconnecting Technology, CO,. LTD, Shenzhen, China 4.AKMMeadville Electronics (Xiamen) Co.,Ltd, NO.99 Yongcuo Road, Haicang District, Xiamen, China |
| 第一作者单位 | 深港微电子学院 |
| 第一作者的第一单位 | 深港微电子学院 |
| 推荐引用方式 GB/T 7714 |
Shizhen Li,Xu Liu,Chenshan Gao,et al. Multi Physics Simulation of Wafer Bonding with Nano Copper Paste[C],2024.
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| 条目包含的文件 | 条目无相关文件。 | |||||
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