Investigation on Silver Nanowire/Resin-Induced Liquid Crystal Polymer Metallization

Yongjiang Zhang1,2; Zhiqiang Lai1; Dan Liu1; Tao Zhao1; Xianwen Liang1; Rong Sun1; Xianzhu Fu3; Ning Wang1

10.1109/ICEPT59018.2023.10492403

2023-08-11

2836-9734

979-8-3503-3882-9

2023 24th International Conference on Electronic Packaging Technology (ICEPT)

8-11 Aug. 2023

Shihezi City, China

With the rapid advance of the fifth-generation (5G) communication technology, millimeter-wave, and terahertz frequencies have attracted great attention in advanced wireless communication. However, the traditional printed circuit board materials with the disadvantages of high dielectric constant and loss, and high absorbency have struggled to meet the demands of high-frequency communication. Liquid crystal polymer (LCP) is used as a printed circuit board material widely applied in electronic products and communication equipment due to its low dielectric constant and loss, as well as low water absorption. In this paper, silver nanowire (AgNW) /resin material was employed to induce the metalization of LCP. Initially, plasma treatment was utilized to improve the surface energy of LCP with micro-blind holes. Subsequently, a resin containing fillers was pre-coated on the LCP substrate as a primer, where the fillers could form surface void structures. Then, AgNWs were spin-coated on the primer as a conductive seed layer and embedded within the surface voids of the primer. Finally, copper was electrodeposited onto the surface of the AgNW seed layer, and the deposited copper atoms were filled into the voids of the primer under the induction of AgNWs, forming an "interlocking" structure between the copper layer and the primer, which significantly enhanced the adhesion of the metal layer. Furthermore, the microstructure and mechanical properties of copper metalized LCP were characterized. The microstructure of copper-plated micro blind holes in LCP was observed by the metallographic microscope, and the micro blind holes were filled. The surface morphology of the copper layer was assessed by scanning electron microscopy, and its surface was flat and dense. The adhesion of the copper layer was tested by the hundred-grid method and reached 4B. In comparison with traditional fabricating methods of LCP copper-clad laminations, this method with the advantages of ease of process, high efficiency, high performance, and universality for different substrates and metal layers, broadens the avenue to metalize insulating substrates.

其他

1.Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, China
2.Southern University of Science and Technology, Shenzhen, China
3.College of Materials Science and Engineering, Shenzhen University, Shenzhen, China

Yongjiang Zhang,Zhiqiang Lai,Dan Liu,et al. Investigation on Silver Nanowire/Resin-Induced Liquid Crystal Polymer Metallization[C],2023.