A Novel UV-curable Modified Epoxy Resin with High Glass Transition Temperature and Comprehensive Properties

Yexin Zhang1,2; Xialei Lv1; Jinhui Li1; Guoping Zhang1; Rong Sun1

10.1109/ICEPT59018.2023.10492202

2023-08-11

2836-9734

979-8-3503-3882-9

2023 24th International Conference on Electronic Packaging Technology (ICEPT)

8-11 Aug. 2023

Shihezi City, China

Solder resist (SR) with excellent photo lithography resolution, low CTE, high thermal resistance and outstanding mechanical performance functions as a significant role in advanced packaging. However, the glass transition temperature need to be further reinforced to meet the requirements in high density and high-performance packaging. This work adopts the method of acrylic modification of epoxy resins and the structural control strategy of combining rigidity and flexibility of modified epoxy resins to enhance the properties of SR films. Phenolic epoxy and bisphenol F epoxy were modified and combined with other additives to prepare SR. The prepared thin films showed superior comprehensive performance. The highest glass transition temperature (Tg) was 179.6 °C, and the thermal decomposition temperature (Td5) was as high as 344.5 °C. Satisfactory mechanical properties including tensile strength of 85.37 MPa, elongation at break of 3.50%, storage modules of 4.26 GPa, CTE of 37.9 ppm/°C and Young's modulus of 6.11 GPa were obtained. Additionally, SR films exhibited excellent alkali solubility and photo lithography resolution. In summary, the modified epoxy resins can be regarded as promising candidates for photosensitive resin of high-performance solder resist utilized in advanced electronic packaging.

其他

1.Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, China
2.Shenzhen University of Technology, Southern University of Science and Technology, Shenzhen, China

Yexin Zhang,Xialei Lv,Jinhui Li,et al. A Novel UV-curable Modified Epoxy Resin with High Glass Transition Temperature and Comprehensive Properties[C],2023.