Direct Monitoring of Nanoscale Deformations across All Layers in Three-Dimensional Stacked Structures

Zhao, Xiangyu1; Jiang, Hao1,3; Liu, Jiamin1; Liu, Changqing1; Deng, Hui4; Zhou, Renjie5; Fang, Nicholas X.6; Liu, Shiyuan1,3; Zhu, Jinlong1,2,3

2024-08-01

10.1021/acsphotonics.4c00784

ACS PHOTONICS   影响因子和分区

2330-4022

Due to its high bandwidth, low latency, low power consumption, and compact size, three-dimensional (3D) integration of semiconductor chips holds the promise of boosting the performance of integrated circuit systems. However, the applications of 3D stacked structures are constrained by the surface deformation of each thin layer induced by thermal effects, vibration, gravity, and other environmental stresses. Therefore, ensuring the performance and reliability of 3D stacked structures necessitates the precise measurement of nanoscale deformation in each layer. Furthermore, the spacing between layers in 3D stacked structures using modern microelectronics and packaging technologies is exceedingly small, making it impossible to measure the deformation of all layers. Here, we present a novel optical endoscope that fuses a miniaturized interferometry array, a laser-fabricated microprobe, and a highly efficient profile reconstruction algorithm for the precise measurements of surface deformation across all layers in 3D stacked structures. Our method offers a potentially effective and noninvasive way to address the challenges associated with in-line deformation measurement across all layers in real 3D stacked wafers and chips.

3D stacked structures surface deformationmetrology optical endoscope nanoscale deformation noninvasive

SCI ; EI

英语

其他

National Nature Science Foundation of China["52175509","52130504"] ; National Key Research and Development Program of China[2023YFF1500900] ; Shenzhen Fundamental Research Program[JCYJ20220818100412027] ; Guangdong-Hong Kong Technology Cooperation Funding Scheme Category C Platform[SGDX20230116093543005] ; The 2021 Postdoctoral Innovation Research Plan of Hubei Province[0106100226] ; Innovation Project of Optics Valley Laboratory[OVL2023PY003]

Science & Technology - Other Topics ; Materials Science ; Optics ; Physics

Nanoscience & Nanotechnology ; Materials Science, Multidisciplinary ; Optics ; Physics, Applied ; Physics, Condensed Matter

WOS:001302835300001

AMER CHEMICAL SOC

Web of Science

1.Huazhong Univ Sci & Technol, State Key Lab Intelligent Mfg Equipment & Technol, Wuhan 430074, Peoples R China
2.Huazhong Univ Sci & Technol Shenzhen, Res Inst, Shenzhen 518057, Peoples R China
3.Opt Valley Lab, Wuhan 430074, Hubei, Peoples R China
4.Southern Univ Sci & Technol, Dept Mech & Energy Engn, Shenzhen 518055, Guangdong, Peoples R China
5.Chinese Univ Hong Kong, Dept Biomed Engn, Hong Kong, Peoples R China
6.Univ Hong Kong, Dept Mech Engn, Hong Kong, Peoples R China

Zhao, Xiangyu,Jiang, Hao,Liu, Jiamin,et al. Direct Monitoring of Nanoscale Deformations across All Layers in Three-Dimensional Stacked Structures[J]. ACS PHOTONICS,2024.

Zhao, Xiangyu.,Jiang, Hao.,Liu, Jiamin.,Liu, Changqing.,Deng, Hui.,...&Zhu, Jinlong.(2024).Direct Monitoring of Nanoscale Deformations across All Layers in Three-Dimensional Stacked Structures.ACS PHOTONICS.

Zhao, Xiangyu,et al."Direct Monitoring of Nanoscale Deformations across All Layers in Three-Dimensional Stacked Structures".ACS PHOTONICS (2024).