题名 | Ion beam smoothing of fused silica at atomic-scale assisted by damage recovery using inductively coupled plasma |
作者 | |
通讯作者 | Wang, Yinhui; Deng, Hui |
发表日期 | 2024-10
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DOI | |
发表期刊 | |
ISSN | 0141-6359
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卷号 | 90页码:71-80 |
摘要 | For conventional optical manufacturing combining ion beam figuring (IBF) and abrasive finishing, it is difficult to achieve an atomic-scale smooth surface with microroughness below 0.1 nm. Because the abrasives inevitably damage the surface, and the damages are exposed during ion sputtering. To solve this problem, plasma-induced atom migration manufacturing (PAMM) and IBF were combined in this study. PAMM is a damage recovery process based on atom migration effect. In this study, PAMM was employed to recover the subsurface damage and then the damage-less surface was further processed by IBF to remove the form error as well as reduce the roughness to atomic level. Full spatial frequency error convergence was achieved via the combined process of PAMM and IBF. A good surface accuracy of 3.89 nm RMS and an atomically smooth surface with a roughness of 0.044 nm were obtained. The less damage characteristic of the hybrid process was also demonstrated by buffered oxide etching (BOE). This study proposed and verified a hybrid process combining PAMM for damage recovery and IBF for figuring and atomic-scale smoothing, which provided a novel process strategy for manufacturing ultra-precision optics with high quality. © 2024 Elsevier Inc. |
收录类别 | |
语种 | 英语
|
学校署名 | 第一
; 通讯
|
资助项目 | This work was supported by the National Natural Science Foundation of China (52375437, 52035009) and the Natural Science Foundation of Guangdong Province (2024B1515020027). The authors would like to thank the Shenzhen Science and Technology Program (Grant No. KQTD20170810110250357) for the financial support. The authors acknowledge the assistance of SUSTech Core Research Facilities. This work was also supported by Shenzhen Engineering Research Center for Semiconductor-specific Equipment.
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出版者 | |
EI入藏号 | 20243316881750
|
EI主题词 | Atoms
; Etching
; Inductively coupled plasma
; Ion beams
; Ions
; Recovery
; Surface roughness
|
EI分类号 | Chemical Reactions:802.2
; Glass:812.3
; Physical Properties of Gases, Liquids and Solids:931.2
; Atomic and Molecular Physics:931.3
; High Energy Physics:932.1
; Plasma Physics:932.3
|
ESI学科分类 | ENGINEERING
|
来源库 | EV Compendex
|
引用统计 | |
成果类型 | 期刊论文 |
条目标识符 | http://sustech.caswiz.com/handle/2SGJ60CL/807040 |
专题 | 工学院_机械与能源工程系 南方科技大学 |
作者单位 | 1.Department of Mechanical and Energy Engineering, Southern University of Science and Technology, Guangdong, Shenzhen; 518055, China 2.Shenzhen Engineering Research Center for Semiconductor-specific Equipment, Department of Mechanical and Energy Engineering, Southern University of Science and Technology, Guangdong, Shenzhen; 518055, China 3.Boffotto Semiconductor Limited, No.118 Dongcheng Road, Hongqi Town, Guangdong Province, Zhuhai City, China 4.The authors contribute equally to this paper. |
第一作者单位 | 机械与能源工程系 |
通讯作者单位 | 机械与能源工程系 |
第一作者的第一单位 | 机械与能源工程系 |
推荐引用方式 GB/T 7714 |
Wu, Bing,Liang, Shaoxiang,Zhang, Junqi,et al. Ion beam smoothing of fused silica at atomic-scale assisted by damage recovery using inductively coupled plasma[J]. Precision Engineering,2024,90:71-80.
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APA |
Wu, Bing.,Liang, Shaoxiang.,Zhang, Junqi.,Ding, Xuemiao.,Chiu, Tom.,...&Deng, Hui.(2024).Ion beam smoothing of fused silica at atomic-scale assisted by damage recovery using inductively coupled plasma.Precision Engineering,90,71-80.
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MLA |
Wu, Bing,et al."Ion beam smoothing of fused silica at atomic-scale assisted by damage recovery using inductively coupled plasma".Precision Engineering 90(2024):71-80.
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条目包含的文件 | 条目无相关文件。 |
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