A highly efficient semi-finishing approach for polycrystalline diamond film via plasma-based anisotropic etching

Liu, Nian1,2; Lei, Ling1; Jiang, Huilong1; Zhang, Yongjie3; Xiao, Junfeng1; Zhang, Jianguo1; Chen, Xiao4; Xu, Jianfeng1; Yamamura, Kazuya5

2024-11-01

10.1016/j.jmatprotec.2024.118578

JOURNAL OF MATERIALS PROCESSING TECHNOLOGY   影响因子和分区

0924-0136

1873-4774

Plasma anisotropic etching polishing (plasma-AEP), a non-contact polishing method, is proposed to achieve highly efficient planarization of polycrystalline diamond (PCD) films. Inductively coupled plasma, with a high concentration of reactive radicals, serves as the source of plasma-AEP. In-situ observation confirms that the planarization effect of plasma-AEP is realized through the preferential removal of the top areas of the pyramidshaped protrusions, despite the entire surface being uniformly irradiated by the plasma. The material removal rate in plasma-AEP for PCD achieves 127 mu m/min. Plasma-AEP is proven effective for PCD films with thicknesses of 0.5, 1, and 2 mm, demonstrating a generic semi-finishing approach for PCD regardless of thickness. Atomicscale nudged elastic band calculations revealed that the energy barriers for CO and CO2 desorption from 1- and 2coordinated C atoms are significantly lower than those for 3- and 4-coordinated ones. ReaxFF molecular dynamics simulations showed that at the top areas of the pyramid-shaped protrusions, 1- and 2-coordinated C atoms with a higher etching priority remained dominant during plasma-AEP, leading to the preferential removal of C atoms forming these protrusions. Furthermore, contact polishing was added to complete the finishing of the PCD film, followed by plasma-AEP, resulting in a nanoscale smooth surface with a roughness of 3.4 nm. Transmission electron microscopy confirmed that the crystal structures on the surface and subsurface of the PCD film were well ordered. Overall, this paper displays that plasma-AEP is a promising approach for highly efficient semi-finishing of PCD films.

Polycrystalline diamond film Polishing Inductively coupled plasma Anisotropic etching ReaxFF MD

SCI

英语

其他

National Natural Science Foundation of China["52405477","52225506"]

Engineering ; Materials Science

Engineering, Industrial ; Engineering, Manufacturing ; Materials Science, Multidisciplinary

WOS:001307842400001

ELSEVIER SCIENCE SA

Web of Science

1.Huazhong Univ Sci & Technol, Sch Mech Sci & Engn, State Key Lab Intelligent Mfg Equipment & Technol, Luoyu Rd 1037, Wuhan 430074, Hubei, Peoples R China
2.Minist Educ, Key Lab Adv Mfg Technol High Performance Parts, Shanghai, Peoples R China
3.Southern Univ Sci & Technol, Dept Mech & Energy Engn, Shenzhen 518055, Guangdong, Peoples R China
4.Hubei Univ Technol, Sch Mech & Engn, Wuhan 430074, Hubei, Peoples R China
5.Osaka Univ, Res Ctr Precis Engn, Grad Sch Engn, 2-1 Yamadaoka, Suita, Osaka 5650871, Japan

Liu, Nian,Lei, Ling,Jiang, Huilong,et al. A highly efficient semi-finishing approach for polycrystalline diamond film via plasma-based anisotropic etching[J]. JOURNAL OF MATERIALS PROCESSING TECHNOLOGY,2024,332.

Liu, Nian.,Lei, Ling.,Jiang, Huilong.,Zhang, Yongjie.,Xiao, Junfeng.,...&Yamamura, Kazuya.(2024).A highly efficient semi-finishing approach for polycrystalline diamond film via plasma-based anisotropic etching.JOURNAL OF MATERIALS PROCESSING TECHNOLOGY,332.

Liu, Nian,et al."A highly efficient semi-finishing approach for polycrystalline diamond film via plasma-based anisotropic etching".JOURNAL OF MATERIALS PROCESSING TECHNOLOGY 332(2024).