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题名

Study on the effects of surface hydroxyl of silica fillers on the mechanical properties of underfills

作者
通讯作者Li, Gang; Zhu, Pengli
DOI
发表日期
2023
会议名称
24th International Conference on Electronic Packaging Technology (ICEPT)
ISSN
2836-9734
会议录名称
会议日期
AUG 08-11, 2023
会议地点
null,Shihezi,PEOPLES R CHINA
出版地
345 E 47TH ST, NEW YORK, NY 10017 USA
出版者
摘要
As the flip-chip bump becomes smaller, the filler in underfill becomes nano-sized silica particles. However, there are few studies on the influence of the surface chemical state of silica on the mechanical properties of underfills. To explore this point, we prepared calcined and uncalcined SiO2 nanoparticles, respectively, and then used them to fabricate two types of epoxy-based composites. And we compared the mechanical and thermal properties of two different composite materials. We found that the -OH-free SiO2 filled composite materials have better properties. The SEM image of the crosssection shows that the compatibility of -OH-free SiO2 with epoxy resin matrix is better. Therefore, the surface hydroxyl groups of SiO2 have a deteriorated effect on the reliability of the underfills. Finally, the reasons were explored through section analysis and thermodynamic analysis.
关键词
学校署名
其他
语种
英语
相关链接[来源记录]
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资助项目
Shenzhen RD project[JSGGZD20220822100001002] ; Key-Area Research and Development Program of Guangdong Province[2023B0101030002]
WOS研究方向
Engineering ; Materials Science
WOS类目
Engineering, Manufacturing ; Engineering, Electrical & Electronic ; Materials Science, Multidisciplinary
WOS记录号
WOS:001221819200290
来源库
Web of Science
引用统计
成果类型会议论文
条目标识符http://sustech.caswiz.com/handle/2SGJ60CL/828771
专题南方科技大学
作者单位
1.Univ Sci & Technol, Nano Sci & Technol Inst, Suzhou, Peoples R China
2.Chinese Acad Sci, Shenzhen Inst Adv Technol, Shenzhen Inst Adv Elect Mat, Shenzhen, Peoples R China
3.South Univ Sci & Technol China, Shenzhen, Peoples R China
推荐引用方式
GB/T 7714
Zhang, Zhenguo,Yu, Xuecheng,Zhang, Leicong,et al. Study on the effects of surface hydroxyl of silica fillers on the mechanical properties of underfills[C]. 345 E 47TH ST, NEW YORK, NY 10017 USA:IEEE,2023.
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