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题名

INVITED TALK for sub-area "Emissive, Micro‐LED, and Quantum‐Dot Display": On the strive towards all-InGaN sub-2µm sized RGB microLEDs

作者
通讯作者Samuelson, Lars
DOI
发表日期
2024
会议名称
International Symposium, Seminar, and Exhibition, Display Week 2024
ISSN
0097-966X
EISSN
2168-0159
会议录名称
卷号
55
页码
708
会议日期
May 12, 2024 - May 17, 2024
会议地点
San Jose, CA, United states
出版者
摘要
III-Nitride based LEDs based on InGaN active layers on GaN work very well for the blue and green emitting LEDs. However, the large lattice mis-match between redemitting active layers, with at least 35% indium in the active layers, and the GaN substrate still limits the efficiencies obtained to very low values. Unfortunately, the approach to use GaAs based (GaAs/AlInGaP) devices for the red fails for LEDs much smaller than 20μm, while AR-applications require pixel sizes down to, or even below, 2μm. After a review of the status of different approaches published towards all-nitride technologies, I will focus on our concept of realizing relaxed templates of InGaN on top of which we form sub-µm sized nanoLEDs.
© 2024, John Wiley and Sons Inc. All rights reserved.
学校署名
第一 ; 通讯
语种
英语
收录类别
EI入藏号
20243616972670
EI主题词
Gallium arsenide ; Gallium nitride ; Indium alloys ; Lattice mismatch ; Nanocrystals ; Semiconductor quantum dots
EI分类号
:1301.4.1 ; :1301.4.1.1 ; :202.9.3 ; Compound Semiconducting Materials:712.1.2 ; Semiconductor Devices and Integrated Circuits:714.2 ; Nanotechnology:761 ; Chemical Products Generally:804
来源库
EV Compendex
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成果类型会议论文
条目标识符http://sustech.caswiz.com/handle/2SGJ60CL/832786
专题南方科技大学
作者单位
1.Institute of Nanoscience and Applications, Southern University of Science and Technology, Shenzhen, China
2.Solid State Physics and NanoLund, Lund University, Lund, Sweden
3.Hexagem AB, Ideon Science Park, Lund, Sweden
第一作者单位南方科技大学
通讯作者单位南方科技大学
第一作者的第一单位南方科技大学
推荐引用方式
GB/T 7714
Samuelson, Lars. INVITED TALK for sub-area "Emissive, Micro‐LED, and Quantum‐Dot Display": On the strive towards all-InGaN sub-2µm sized RGB microLEDs[C]:John Wiley and Sons Inc,2024:708.
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