Application of Nano Copper Paste in Large-Area Sintering: A Study on Enhancing Its Sintering Performance

Chenshan Gao1; Shizhen Li1; Qian Yao2; Yuhong Li3; Jiafeng Liu4; Tiancheng Tian5; Lingen Wang6; Shaohui Wu7; Huaiyu Ye1

10.1109/ICEPT63120.2024.10668777

2024-08-09

2836-9734

979-8-3503-5381-5

2024 25th International Conference on Electronic Packaging Technology (ICEPT)

7-9 Aug. 2024

Tianjin, China

Silicon carbide power chips require interconnection materials with high thermal and electrical conductivity, stability at high temperatures, and resistance to electro migration. Nano-metal sintering technology, particularly using nano-silver and nano-copper, has emerged as a promising solution. This study investigates the large-area sintering (LAS) performance of different substrates and printing thicknesses. The results show that pure copper (Cu) substrates provide superior bonding compared to nickel (Ni)-plated ones, and the sintered layer thickness varies significantly with stencil thickness. The presence of a cross-shaped channel improves the volatilization of organic compounds, reducing porosity. These findings highlight the potential of nano-metal sintering materials in enhancing the reliability and performance of high-power chips.

第一

1.School of Microelectronics, Southern University of Science and Technology, Shenzhen, China
2.Shennan Circuits Co.,LTD, Shenzhen, China
3.R&D Departnment, Sky Chip Interconnection Technology Co.,LTD, Shenzhen, China
4.School of Software, Shenyang University of Technology, Shenyang, China
5.R&D Departnment, Suzhou Boschman Semiconductor Equipment Co.,LTD, Suzhou, China
6.R&D Departnment, Boschman Technologies B. V., Amsterdam, Netherlands
7.R&D Center AKMMeadville Electronics (Xiamen) Co.,LTD, Xiamen, China

Chenshan Gao,Shizhen Li,Qian Yao,et al. Application of Nano Copper Paste in Large-Area Sintering: A Study on Enhancing Its Sintering Performance[C],2024.