Effects of curing condition and solder mask on substrate warpage: an experimental and simulation study

Fan, Guowei1,2; Hu, Zengming1,2; Xu, Jie1,2; Tang, Junqi3; Liu, Dashun4; Fang, Zeming1,2; Luo, Li3; Liu, Qianfa3; Lu, Dong5; Xue, Ke5; Wang, Ke1,2

2024-09-01

10.1007/s10854-024-13499-z

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS   影响因子和分区

0957-4522

1573-482X

The warpage of the package substrate mainly originates from the material property and size variations of individual components, especially when multiple components are involved. To maintain the substrate warpage within acceptable limits, it's crucial to fine-tune component parameters carefully, choosing appropriate materials and processing conditions. The current study investigates the factors influencing substrate warpage and explores the methods to mitigate it with the assistance of finite element analysis. Glass fiber reinforced epoxy-based substrates were prepared under different curing temperatures, and characterized by thermo-mechanical analysis and mechanical testing. A finite element simulation model of the bare carrier board was developed using ABAQUS software. The results show that the curing temperature impacts the coefficient of thermal expansion (CTE), strength and modulus of the substrate. The differences in CTE and dimensional parameters among the component materials strongly influence substrate warpage. While the curing conditions affect bare carrier board warpage to some extent, the type and thickness of solder mask have more significant effects and warpage can be mitigated by properly choosing and applying solder masks.

SCI

英语

第一 ; 通讯

National Natural Science Foundation of China[2023B0101020004] ; Department of Science and Technology of Guangdong Province[62374080] ; National Natural Science Foundation of China[ZDSYS20220527171404011]

Engineering ; Materials Science ; Physics

Engineering, Electrical & Electronic ; Materials Science, Multidisciplinary ; Physics, Applied ; Physics, Condensed Matter

WOS:001314760200002

SPRINGER

Web of Science

1.Southern Univ Sci & Technol, Shenzhen Key Lab Adv Energy Storage, Shenzhen 518055, Peoples R China
2.Southern Univ Sci & Technol, Sch Syst Design & Intelligent Mfg, Shenzhen 518055, Peoples R China
3.Guangdong Shengyi Technol Co Ltd, Dongguan 523000, Peoples R China
4.Guangzhou HKUST Fok Ying Tung Res Inst, Div Adv Engn Mat, Guangzhou 511458, Guangdong, Peoples R China
5.Hong Kong Univ Sci & Technol Guangzhou, Guangzhou, Peoples R China

Fan, Guowei,Hu, Zengming,Xu, Jie,et al. Effects of curing condition and solder mask on substrate warpage: an experimental and simulation study[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2024,35(26).

Fan, Guowei.,Hu, Zengming.,Xu, Jie.,Tang, Junqi.,Liu, Dashun.,...&Wang, Ke.(2024).Effects of curing condition and solder mask on substrate warpage: an experimental and simulation study.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,35(26).

Fan, Guowei,et al."Effects of curing condition and solder mask on substrate warpage: an experimental and simulation study".JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 35.26(2024).