Ultrasonic vibration-assisted grinding of quartz glass micro-hole

Lu，Yanjun1; Guo，Mingrong1; Dai，Yongqi1; Wang，Qiang2; Luo，Hu3; Wu，Yongbo2

2024-12-01

10.1016/j.precisioneng.2024.09.021

Precision Engineering   影响因子和分区

0141-6359

Quartz glass is extensively utilized in the aviation and biomedical fields. However, achieving high-quality ultrafine micro-holes on quartz glass is difficult because edge chipping and internal surface defects are prone to occur during processing. Therefore, the ultrasonic vibration-assisted grinding (UVAG) was proposed to realize efficient and low-damage precision machining of quartz glass micro-holes. First, the brittle-to-plastic transition depth and theoretical motion trajectory of a single grit of quartz glass in UVAG were analyzed. Subsequently, comparative experiments were conducted between UVAG and conventional grinding (CG) to machine quartz glass micro-holes. Finally, the influences of different parameters on grinding force, edge chipping, entrance and exit diameters, and internal surface quality were investigated. The experiments demonstrated that the grinding force, edge chipping at the entrance and exit, and internal surface roughness can be effectively reduced by UVAG compared to CG. After UVAG, the axial grinding force, size of the edge chips at the entrance and exit, and internal surface roughness decreased by 40.97 %, 36.28 %, 42.09 %, and 12.59 %, respectively. After optimizing the process parameters of UVAG, the size of edge chipping at the entrance and exit were 6.5 μm and 7 μm, respectively, and the internal surface roughness reached 0.146 μm. In this case, the diameter of the micro-hole was 112 μm, and had a depth-to-diameter ratio greater than 10.

Edge chipping Grinding force Micro-hole Quartz glass Surface roughness Ultrasonic vibration-assisted grinding

英语

其他

2-s2.0-85205435429

Scopus

1.Guangdong Provincial Key Laboratory of Micro/Nano Optomechatronics Engineering,College of Mechatronics and Control Engineering,Shenzhen University,Shenzhen,518060,China
2.Department of Mechanical and Energy Engineering,Southern University of Science and Technology,Shenzhen,518055,China
3.Shenzhen Multi-Field Precision Co.,LTD,Shenzhen,518100,China

Lu，Yanjun,Guo，Mingrong,Dai，Yongqi,et al. Ultrasonic vibration-assisted grinding of quartz glass micro-hole[J]. Precision Engineering,2024,91:321-335.

Lu，Yanjun,Guo，Mingrong,Dai，Yongqi,Wang，Qiang,Luo，Hu,&Wu，Yongbo.(2024).Ultrasonic vibration-assisted grinding of quartz glass micro-hole.Precision Engineering,91,321-335.

Lu，Yanjun,et al."Ultrasonic vibration-assisted grinding of quartz glass micro-hole".Precision Engineering 91(2024):321-335.