A universal packaging substrate for mechanically stable assembly of stretchable electronics

Shao，Yan1,2; Yan，Jianfeng1; Zhi，Yinglin1; Li，Chun1; Li，Qingxian3; Wang，Kaimin1; Xia，Rui1; Xiang，Xinyue1; Liu，Liqian1; Chen，Guoli1; Zhang，Hanxue1; Cai，Daohang1; Wang，Haochuan1; Cheng，Xing1; Yang，Canhui3; Ren，Fuzeng1; Yu，Yanhao1,4

2024-12-01

10.1038/s41467-024-50494-8

Nature Communications   影响因子和分区

2041-1723

Stretchable electronics commonly assemble multiple material modules with varied bulk moduli and surface chemistry on one packaging substrate. Preventing the strain-induced delamination between the module and the substrate has been a critical challenge. Here we develop a packaging substrate that delivers mechanically stable module/substrate interfaces for a broad range of stiff and stretchable modules with varied surface chemistries. The key design of the substrate was to introduce module-specific stretchability and universal adhesiveness by regionally tuning the bulk molecular mobility and surface molecular polarity of a near-hermetic elastic polymer matrix. The packaging substrate can customize the deformation of different modules while avoiding delamination upon stretching up to 600%. Based on this substrate, we fabricated a fully stretchable bioelectronic device that can serve as a respiration sensor or an electric generator with an in vivo lifetime of 10 weeks. This substrate could be a versatile platform for device assembly.

SCI

英语

第一 ; 通讯

2-s2.0-85199104806

Scopus

1.Department of Materials Science and Engineering,Southern University of Science and Technology,Shenzhen,518055,China
2.School of Materials Science and Engineering,Yancheng Institute of Technology,Yancheng,224051,China
3.Shenzhen Key Laboratory of Soft Mechanics & amp; Smart Manufacturing,Department of Mechanics and Aerospace Engineering,Southern University of Science and Technology,Shenzhen,518055,China
4.Guangdong Provincial Key Laboratory of Sustainable Biomimetic Materials and Green Energy,Southern University of Science and Technology,Shenzhen,518055,China

Shao，Yan,Yan，Jianfeng,Zhi，Yinglin,et al. A universal packaging substrate for mechanically stable assembly of stretchable electronics[J]. Nature Communications,2024,15(1).

Shao，Yan.,Yan，Jianfeng.,Zhi，Yinglin.,Li，Chun.,Li，Qingxian.,...&Yu，Yanhao.(2024).A universal packaging substrate for mechanically stable assembly of stretchable electronics.Nature Communications,15(1).

Shao，Yan,et al."A universal packaging substrate for mechanically stable assembly of stretchable electronics".Nature Communications 15.1(2024).